Document
SMDJ Series
TVS Diodes
Surface Mount – 3000W > SMDJ series
RoHS
Pb e3
Uni-directional
Bi-directional
Agency Approvals Agency
Agency File Number E230531
Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted)
Parameter
Peak Pulse Power Dissipation(Fig.2) by 10/1000us Test Waveform(Fig.4) (Note 1),(Note 2) -Single Die Parts
Peak Pulse Power Dissipation(Fig.2) by 10/1000us Test Waveform(Fig.4) (Note 1), (Note 2) -Stacked Die Parts (Note 5)
Symbol PPPM PPPM
Value 3000 4000
Unit W W
Power Dissipation on Infinite Heat Sink at TL=50OC
PD
6.5
W
Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3)
IFSM
300
A
Maximum Instantaneous Forward Voltage at 100A for Unidirectional Only(Note 4)
VF
3.5/5.0
V
Operating Temperature Range
TJ
-65 to 150
°C
Storage Temperature Range
TSTG
-65 to 175
°C
Typical Thermal Resistance Junction to Lead
RƟJL
15
°C/W
Typical Thermal Resistance Junction to Ambient
RƟJA
75
°C/W
Notes: 1. Non-repetitive current pulse , per Fig. 4 and derated above TJ (initial) =25OC per Fig. 3. 2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional component only, duty cycle=4 per minute maximum.
4. VF < 3.5V for single die parts and VF< 5.0V for stacked-die parts. 5. For stacked die component details, please refer to part numbers labeled by * in Electrical
Characteristics.
Functional Diagram
Description
The SMDJ series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.
Features
• 3000W PPPM capability at 10/1000μs waveform,
• Low incremental surge resistance
repetition rate (duty cycles):0.01%
• For surface mounted applications in order to optimize board space
• Typical IR less than 2μA when VBR min>12V
• High temperature to reflow soldering guaranteed: 260°C/30sec
• Low profile package
• VBR @ TJ= VBR@25°C x (1+αT
• Typical failure mode is short
x (TJ - 25))(αT:Temperature
from over-specified voltage or Coefficient, typical
current
value is 0.1%)
• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
• UL Recognized compound meeting flammability rating V-0
• IEC-61000-4-2 ESD 30kV(Air), • Meet MSL level1, per
30kV (Contact)
J-STD-020, LF maximun peak
• ESD protection of data lines
of 260°C
in accordance with
• Matte tin lead–free plated
IEC 61000-4-2
• Halogen free and
• EFT protection of data lines in RoHS compliant
accordance with IEC 61000-4-4
• Pb-free E3 means 2nd level interconnect is Pb-free and
• Built-in strain relief
the terminal finish material is
• Glass passivated chip junction • Fast response time: typically
tin(Sn) (IPC/JEDEC J-STD609A.01)
less than 1.0ps from
0V to BV min
• Excellent clamping capability
Applications
TVS components are ideal for the protection of I/O Interfaces, VCC bus and other vulnera.