Document
SSF2306B
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DESCRIPTION
The SSF2306B uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V.
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GENERAL FEATURES
● VDS = 29V,ID = 5A RDS(ON) < 50mΩ @ VGS=2.5V RDS(ON) < 40mΩ @ VGS=4.5V RDS(ON) < 35mΩ @ VGS=10V ● High Power and current handing capability ● Lead free product is acquired ● Surface Mount Package
Schematic diagram
Marking and pin Assignment
Application
●Battery protection ●Load switch ●Power management SOT-23 top view
PACKAGE MARKING AND ORDERING INFORMATION
Device Marking 2306B Device SSF2306B Device Package SOT-23 Reel Size Ø180mm Tape width 8 mm Quantity 3000 units
ABSOLUTE MAXIMUM RATINGS(TA=25℃unless otherwise noted) Parameter Symbol
Drain-Source Voltage Gate-Source Voltage Drain Current-Continuous@ Current-Pulsed (Note 1) Maximum Power Dissipation Operating Junction and Storage Temperature Range
Limit
29 ±12 5 20 1.38 -55 To 150
Unit
V V A A W ℃
VDS VGS ID IDM PD TJ,TSTG
THERMAL CHARACTERISTICS
Thermal Resistance,Junction-to-Ambient (Note 2) RθJA 90 ℃/W
ELECTRICAL CHARACTERISTICS (TA=25℃unless otherwise noted) Parameter Symbol Condition
OFF CHARACTERISTICS Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage Current BVDSS IDSS IGSS VGS=0V ID=250μA VDS=30V,VGS=0V VGS=±12V,VDS=0V
Min
29
Typ
Max
Unit
V
1 ±100
μA nA
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SSF2306B
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ON CHARACTERISTICS (Note 3) Gate Threshold Voltage VGS(th) VDS=VGS,ID=250μA VGS=2.5V, ID=2.6A Drain-Source On-State Resistance RDS(ON) VGS=4.5V, ID=5A VGS=10V, ID=5A Forward Transconductance DYNAMIC CHARACTERISTICS (Note4) Input Capacitance Output Capacitance Reverse Transfer Capacitance SWITCHING CHARACTERISTICS (Note 4) Turn-on Delay Time Turn-on Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge DRAIN-SOURCE DIODE CHARACTERISTICS Diode Forward Voltage (Note 3) VSD VGS=0V,IS=1.2A 1.2 V td(on) tr td(off) tf Qg Qgs Qgd VDS=16V,ID=5A,VGS=4.5V VDS=15V,ID=5A VGS=10V,RGEN=3.3Ω RD=3Ω 6 20 20 3 8.5 1.5 3.2 15 nS nS nS nS nC nC nC Clss Coss Crss VDS=25V,VGS=0V, F=1.0MHz 660 90 70 1050 PF PF PF gFS VDS=5V,ID=5A 13 0.5 1.2 50 40 35 V mΩ mΩ mΩ S
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%. 4. Guaranteed by design, not subject to production testing.
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TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
Vdd Rl D G S Vout
td(on) ton tr
90%
td(off)
toff tf
90%
Vin Vgs Rgen
VOUT
10%
INVERTED
10% 90%
VIN
10%
50%
50%
PULSE WIDTH
Figure 1: Switching Test Circuit
Figure 2:Switching Waveforms
R(t),Normalized Effective Transient Thermal Impedance
Square Wave Pluse Duration(sec) Figure 3: Normalized Maximum Transient Thermal Impedanc
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SSF2306B
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SOT-23 PACKAGE INFORMATION
Dimensions in Millimeters (UNIT:mm)
Symbol A A1 A2 b c D E E1 e e1 L L1 θ NOTES
Dimensions in Millimeters MIN. MAX. 0.900 1.150 0.000 0.100 0.900 1.050 0.300 0.500 0.080 0.150 2.800 3.000 1.200 1.400 2.250 2.550 0.950TYP 1.800 2.000 0.550REF 0.300 0.500 0° 8°
1. All dimensions are in millimeters. 2. Tolerance ±0.10mm (4 mil) unless otherwise specified 3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils. 4. Dimension L is measured in gauge plane. 5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
©Silikron Semiconductor CO.,LTD.
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SSF2306B
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ATTENTION: ■
Any and all Silikron products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your Silikron representative nearest you before using any Silikron products described or contained herein in such applications. Silikron assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all Silikron products described or contained herein. Specifications of any and all Silikron products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipmen.