MTD1302

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MTD1302/D Advance Information HDTMOS E-FET ™ High Density Power FET DPAK for Surface Mount N–Channel Enhancement Mode Silicon Gate This advanced HDTMOS power FET is designed to withstand high energy in the avalanche and commutation modes. This new energy efficient design also offers a drain–to–source diode with a fast recovery time. Designed for low voltage, high speed switching applications in power supplies, converters, and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients. Avalanche Energy Specified Source–to–Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode Diode Is Characterized for Use In Bridge Circuits IDSS and VDS(on) Specified at Elevated Temperature Surface Mount Package Available in 16 mm, 13″ / 2500 Unit Tape & Reel, Add “T4” Suffix to Part Number MTD1302 TMOS POWER FET 20 AMPERES 30 VOLTS RDS(on) = 0.022 OHM ™ CASE 369A–13, Style 2 MAXIMUM RATINGS (TC = 25°C unless otherwise noted) Rating Drain–to–Source Voltage Drain–to–Gate Voltage (RGS = 1.0 MΩ) Gate–to–Source Voltage — Continuous www.DataSheet4U.com — Non–Repetitive (tp ≤ 10 ms) Drain Current — Continuous Drain Current — Continuous @ 100°C Drain Current — Single Pulse (tp ≤ 10 µs) Total Power Dissipation Derate above 25°C Total Power Diss...