I-CODE SLI Label IC bumped wafer specification on UV-tape
Description
SL2ICS2001DW/V1D
I-CODE SLI Label IC bumped wafer specification on UV-tape
Rev. 3.0 — 5 February 2008
150030
Product data sheet addendum
PUBLIC
1. General description
This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base ...
