HB56UW3272ETK-F

HB56UW3272ETK-F www.DataSheet4U.com EO Description Features 256MB Buffered EDO DRAM DIMM 32-Mword × 72-bit, 4k Refresh, 2 Bank Module (36 pcs of 16M × 4 components) E0100H10 (1st edition) (Previous ADE-203-1124A (Z)) Jan. 31, 2001 The HB 56UW 3272ETK belongs to 8-byte DI MM (D ual in-line Memory Module) fa mily , and has bee n deve loped an optimiz ed main memory solution for 4 and 8-byte proc essor applica tions. The HB 56UW 3272ETK is 32 M × 72 Dyna mic R AM Module, mounted 36 piec es of 64-Mbit DR AM (H M5165405) sea led in TS OP pac kage and 2 piec es of 16-bit line drive r sea led in TS SOP pac kage . The HB56UW3272ETK offers Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the HB 56UW 3272ETK is 168-pin socke t type pac kage (dua l lea d out). The ref ore, the HB 56UW 3272ETK makes high density mounting possible without surface mount technology. The HB56UW3272ETK provides common data inputs and outputs. De coupling ca pac itor s ar e mounted beside ea ch TS OP on the module board. 168-pin socket type package (Dual lead out)  Outline : 133.35 mm (Length) × 53.34 mm (Height) × 4.00 mm (Thickness)  Lead pitch : 1.27 mm Single 3.3 V supply: 3.3 ± 0.3V High speed  Access time: tRAC = 50 ns/60 ns (max)  Access time: tCAC = 18 ns/20 ns (max) Low power dissipation  Active mode: 8.78 W/7.49 W (max)  Standby mode (TTL): 295.2 mW (max) JEDEC standard outline buffered 8-byte DIMM Buffered input except RAS and DQ 4-byte interleav...