DatasheetsPDF.com

FCSP130TR Dataheets PDF



Part Number FCSP130TR
Manufacturers Vishay Siliconix
Logo Vishay Siliconix
Description Chip Scale Package Schottky Barrier Rectifier
Datasheet FCSP130TR DatasheetFCSP130TR Datasheet (PDF)

FCSP130TR Vishay High Power Products FlipKY®, 1.0 A FEATURES • Ultra low VF per footprint area • Low thermal resistance • One-fifth footprint of SMA • Super low profile (< 0.7 mm) • Available tested on tape and reel • Small footprint, surface mountable FlipKY® RoHS COMPLIANT • Low forward voltage drop • High frequency operation • Guard ring for enhanced ruggedness and long term reliability • Lead (Pb)-free • Designed for consumer level DESCRIPTION True chip-scale packaging is available from .

  FCSP130TR   FCSP130TR


Document
FCSP130TR Vishay High Power Products FlipKY®, 1.0 A FEATURES • Ultra low VF per footprint area • Low thermal resistance • One-fifth footprint of SMA • Super low profile (< 0.7 mm) • Available tested on tape and reel • Small footprint, surface mountable FlipKY® RoHS COMPLIANT • Low forward voltage drop • High frequency operation • Guard ring for enhanced ruggedness and long term reliability • Lead (Pb)-free • Designed for consumer level DESCRIPTION True chip-scale packaging is available from Vishay HPP. The FCSP130TR surface mount Schottky rectifier has been designed for applications requiring low forward drop and very small footprints on PC boards. Typical applications are in disk drives, switching power supplies, converters, freewheeling diodes, battery charging, and reverse battery protection. The FlipKY® package, is one-fifth the footprint of a comparable SMA package and has a profile of less then 0.7 mm. Combined with the low thermal resistance of the die level device, this makes the FlipKY the best device for application where printed circuit board space is at a premium and in extremely thin application environments such as battery packs, cell phones and PCMCIA cards. PRODUCT SUMMARY IF(AV) VR 1.0 A 30 V www.DataSheet4U.com MAJOR RATINGS AND CHARACTERISTICS SYMBOL IF(AV) VRRM IFSM VF TJ tp = 5 µs sine 1.0 Apk, TJ = 125 °C Range CHARACTERISTICS Rectangular waveform VALUES 1.0 30 220 0.33 - 55 to 150 UNITS A V A V °C VOLTAGE RATINGS PARAMETER Maximum DC reverse voltage Maximum working peak reverse voltage SYMBOL VR VRWM FCSP130TR 30 UNITS V Document Number: 94278 Revision: 02-Jul-08 For technical questions, contact: [email protected] www.vishay.com 1 FCSP130TR Vishay High Power Products FlipKY®, 1.0 A ABSOLUTE MAXIMUM RATINGS PARAMETER Maximum average forward current Maximum peak one cycle non-repetitive surge current at 25 °C Non-repetitive avalanche energy Repetitive avalanche current SYMBOL IF(AV) IFSM 10 ms sine or 6 ms rect. pulse EAS IAR TEST CONDITIONS 50 % duty cycle at TPCB = 120 °C, rectangular waveform 5 µs sine or 3 µs rect. pulse Following any rated load condition and with rated VRRM applied VALUES 1.0 220 21 10 2.0 mJ A A UNITS TJ = 25 °C, IAS = 2.0 A, L = 5.0 mH Current decaying linearly to zero in 1 µs Frequency limited by TJ maximum VA = 1.5 x VR typical ELECTRICAL SPECIFICATIONS PARAMETER SYMBOL 1A Maximum forward voltage drop See fig. 1 VFM (1) 2A 1A 2A Maximum reverse leakage current See fig. 2 Maximum junction capacitance Maximum voltage rate of change Note (1) Pulse width < 300 µs, duty cycle < 2 % IRM (1) CT dV/dt VR = Rated VR TEST CONDITIONS TJ = 25 °C TJ = 125 °C TJ = 25 °C TJ = 125 °C TYP. 0.41 0.46 0.29 0.37 30 10 MAX. 0.45 0.50 0.33 0.40 100 30 210 10 000 µA mA pF V/µs V UNITS VR = 5 VDC (test signal range 100 kHz to 1 MHz) 25 °C Rated VR THERMAL - MECHANICAL SPECIFICATIONS PARAMETER Maximum junction and storage www.DataSheet4U.com temperature range Typical thermal resistance, junction to PCB Maximum thermal resistance, junction to ambient Notes (1) (2) SYMBOL TJ (1), TStg RthJL(2) RthJA DC operation TEST CONDITIONS VALUES - 55 to 150 40 UNITS °C °C/W 62 dP tot 1 ------------ < ------------- thermal runaway condition for a diode on its own heatsink dT J R thJA Mounted on 1" square PCB www.vishay.com 2 For technical questions, contact: [email protected] Document Number: 94278 Revision: 02-Jul-08 FCSP130TR FlipKY®, 1.0 A Vishay High Power Products 160 150 140 130 120 110 100 90 80 Square wave (D = 0.50) 80 % VR applied See note (1) 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 DC D = 3/4 D = 1/2 D = 1/3 D = 1/4 D = 1/5 1.0 TJ = 150 °C TJ = 125 °C TJ = 25 °C 0.1 0 0.2 0.4 0.6 0.8 1.0 Allowable Case Temperature (°C) 10 IF - Instantaneous Forward Current (A) VFM - Forward Voltage Drop (V) Fig. 1 - Maximum Forward Voltage Drop Characteristics (Per Leg) 100 IF(AV) - Average Forward Current (A) Fig. 4 - Maximum Allowable Case Temperature vs. Average Forward Current (Per Leg) 0.5 IR - Reverse Current (mA) 10 Average Power Loss (W) TJ = 150 °C TJ = 125 °C 0.4 D = 0.20 D = 0.25 D = 0.33 D = 0.50 D = 0.75 DC 1 TJ = 100 °C TJ = 75 °C 0.3 0.1 0.2 RMS limit TJ = 50 °C 0.01 0.1 TJ = 25 °C 0.001 0 0 5 10 15 20 25 30 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 VR - Reverse Voltage (V) www.DataSheet4U.com Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage (Per Leg) 1000 IF(AV) - Average Forward Current (A) Fig. 5 - Forward Power Loss Characteristics (Per Leg) 1000 CT - Junction Capacitance (pF) TJ = 25 °C 100 IFSM - Non-Repetitive Surge Current (A) At any rated load condition and with rated VRRM applied following surge 100 10 10 0 5 10 15 20 25 30 10 100 1000 10 000 VR - Reverse Voltage (V) Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage (Per Leg) (1) tp - Square Wave Pulse Duration (µs) Fig. 6 - Maximum Non-Repetitive Surge Current (Per Leg) Note Formula used: TC = TJ - (Pd + PdREV) x RthJC; .


FCSP130LTR FCSP130TR FCSP140ETR


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site.
(Privacy Policy & Contact)