FCSP130LTR

FCSP130LTR Vishay High Power Products FlipKY®, 1 A Chip Scale Package Schottky Barrier Rectifier FEATURES Ultra low VF per footprint area Low leakage Low thermal resistance One-fifth footprint of SMA Super low profile (0.6 mm) Available tested on tape and reel RoHS COMPLIANT APPLICATIONS Reverse polarity protection FlipKY® Current steering Freewheeling Flyback Oring DESCRIPTION Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The four bump 1.5 x 1.5 mm devices can deliver up to 1 A and occupy only 2.3 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon enabling designers to strategically place the diodes on the PCB. This design not only minimizes board space but also reduces thermal resistance and inductance, which can improve overall circuit efficiency. Typical applications include hand-held, portable equipment such as cell phones, MP3 players, bluetooth, GPS, PDAs, and portable hard disk drives where space savings and performance are crucial. PRODUCT SUMMARY IF(AV) VR 1A 30 V www.DataSheet4U.com MAJOR RATINGS AND CHARACTERISTICS SYMBOL VRRM IF(AV) IFSM VF TJ 1 Apk, TJ = 125 °C Rectangular waveform CHARACTERISTICS MAX. 30 1 250 0.33 - 55 to 150 UNITS V A V °C VOLTAGE RATINGS PARAMETER Maximum DC reverse voltage Maximum working peak reverse voltage SYMBOL VR VRWM FCSP130LTR 30 UN...