FCSP07H40TR
Vishay High Power Products
FlipKY® Chip Scale Package Schottky Barrier Rectifier, 0.75 A
FEATURES
• Ultra l...
FCSP07H40TR
Vishay High Power Products
FlipKY® Chip Scale Package
Schottky Barrier Rectifier, 0.75 A
FEATURES
Ultra low VF to footprint area Very low profile (< 0.6 mm) Low thermal resistance Supplied tested and on tape and reel
RoHS
COMPLIANT
APPLICATIONS
Reverse polarity protection Current steering Freewheeling
FlipKY®
Flyback Oring
DESCRIPTION
Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver
Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.75 A and occupy only 1.08 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon enabling designers to strategically place the diodes on the PCB. This design not only minimizes board space but also reduces thermal resistance and inductance, which can improve overall circuit efficiency. Typical applications include hand-held, portable equipment such as cell phones, MP3 players, bluetooth, GPS, PDAs, and portable hard disk drives where space savings and performance are crucial.
PRODUCT SUMMARY
IF(AV) VR 0.75 A 40 V
www.DataSheet4U.com
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL VRRM IF(AV) IFSM VF TJ 0.75 Apk, TJ = 125 °C Rectangular waveform CHARACTERISTICS MAX. 40 0.75 190 0.47 - 55 to 150 UNITS V A V °C
VOLTAGE RATINGS
PARAMETER Maximum DC reverse voltage Maximum working peak reverse voltage SYMBOL VR VRWM FCSP07H40TR 40 UNITS V
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