plerowTM ALN0450
www.DataSheet4U.com
Internally Matched LNA Module Description
The plerowTM ALN-series is the compactly designed surface-mount module for the use of the LNA with or without the following gain blocks in the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS, PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals, CATV and so on. It has an exceptional performance of low noise figure, high gain, high OIP3, and low bias current. The stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. The surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level.
Features
· S21 = 36.6 dB @ 400 MHz = 35.4 dB @ 500 MHz · NF of 0.65 dB over Frequency · Unconditionally Stable · Single 5V Supply · High OIP3 @ Low Current
Specifications (in Production)
Typ. @ T = 25°C, Vs = 5 V, Freq. = 450 MHz, Zo.sys = 50 ohm
Parameter Frequency Range Gain Gain Flatness Noise Figure Output IP3 S11 / S22 Output P1dB Switching Time Supply Current Supply Voltage Impedance Max. RF Input Power Package Type & Size
(3)
Unit MHz dB dB dB dBm dB dBm µsec mA V Ω dBm mm
Specifications Min 400 35 36 ± 0.6 0.65 39 20 40 -18 / -18 21 160 5 50 C.W 23 ~ 25 (before fail) Surface Mount Type, 13Wx13Lx3.8H 180 ± 0.8 0.70 Typ Max 500
2-stage Single Type
More Information
Website: www.asb.co.kr E-mail:
[email protected] Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 ASB Inc., 4th Fl. Venture Town Bldg., 367-17 Goijeong-Dong, Seo-Gu, Daejon 302-716, Korea
Operating temperature is -40°C to +85°C. 1) OIP3 is measured with two tones at an output power of 5 dBm / tone separated by 1 MHz. 2) S11/S22 (max) is the worst value within the frequency band. 3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
Pin Number 3 8 10 (Bottom View) Others Function RF In RF Out Vs Ground
plerow
ALN0450 ASB Inc.
(Top View) Solder Stencil Area
(Side View)
Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side.
Ø0.4 plated thru holes to ground plane (Recommended Footprint)
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plerowTM ALN0450
www.DataSheet4U.com
Internally Matched LNA Module
S-parameters Typical Performance (Measured)
400~500 +5 V
S-parameters & K Factor
Noise Figure
OIP3
P1dB
2/3
www.asb.co.kr
March 2009
plerowTM ALN0450
www.DataSheet4U.com
Internally Matched LNA Module
Application Circuit
VS
+
-
Tantal or MLC (Multi Layer Ceramic) Capacitor
C1 IN
C2
ALN
OUT
1)
The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for the best electrical performance. DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency.
2)
Recommended Soldering Reflow Process
Evaluation Board Layout
Vs
260°C Ramp-up (3˚C/sec) 200°C
20~40 sec
Ramp-down (6°C/sec)
IN
OUT
150°C 60~180 sec
Size 25x25mm (for ALN Series – 13x13mm)
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www.asb.co.kr
March 2009
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