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Mechanical Key Switch (SMD)
B3S
Surface-mounted Device (SMD) Design Meets High-density Mounting Requirements
The whole switch body can be washed after soldering due to its sealing property. Sealed construction provides high reliability in dusty environments. Available with ground terminal for protection against static electricity. Positive tactile feedback. Fully sealed.
Ordering Information
6 6-mm-type B3S-1000 Series
Operating p g force (OF) ( ) Without ground terminal Bags General-purpose High-force Note: 1.57 N (160 gf) 2.25 N (230 gf) B3S-1000 B3S-1002 Embossed tape (see note) B3S-1000P B3S-1002P With ground terminal Bags B3S-1100 B3S-1102 Embossed tape (see note) B3S-1100P B3S-1102P
Switches on embossed tape must be ordered in units of 1,000.
Specifications
Ratings/Characteristics
Switching capacity Insulation voltage Contact configuration Contact resistance Insulation resistance Dielectric strength Bounce time Vibration resistance Shock resistance Life expectancy Ambient temperature Ambient humidity Weight 5 to 24 VDC, 1 to 30 mA (resistive load) 30 VDC SPST-NO 100 mΩ max. (initial value) (Rated 5 VDC, 1 mA) 100 MΩ min. (at 250 VDC) 500 VAC, 50/60 Hz for 1 min 5 ms max. Malfunction: 10 to 55 Hz, 1.5-mm double amplitude Destruction: 1,000 m/s2 min. (approx. 100G min.) Malfunction: 100 m/s2 min. (approx. 10G min.) General-purpose models: High-force models: Operating: 35% to 85% Approx. 0.30 g 500,000 operations min. 300,000 operations min.
Operating: –25°C to 70°C (with no icing)
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B3S Operating Characteristics
Item General-purpose models Operating force (OF max.) Reset force (RF min.) Pretravel (PT) www.datasheet4u.com 1.57 N (160 gf) max. 0.2 N (20 gf) min. 0.25
+0.2/ –0.1
B3S
B3S-1000 Series High-force models 2.25 N (230 gf) max. 0.49 N (50 gf) min.
mm
2
B3S
B3S
Engineering Data
Operating Force vs. Stroke (Typical)
Operating force (gf)
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High-force models
General-purpose models
Stroke S (mm)
Nomenclature
Plunger
Cover
Spacer Sealing rubber Moving contact (disk spring)
Base
Fixed contact
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B3S
B3S
Dimensions
Note: All units are in millimeters unless otherwise indicated.
Without Ground Terminal
B3S-1000 B3S-1002
3.3 dia.
PCB Mounting (Top View)
Terminal Arrangement /Internal Connections (Top View)
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With Ground Terminal
B3S-1100 B3S-1102
3.3 dia.
PCB Mounting (Top View)
Terminal Arrangement /Internal Connections (Top View)
Precautions
Reflow Soldering
Attach a thermocouple to one side of the terminal with high-temperature solder and use the thermocouple to set the reflow oven to a peak terminal temperature of 230°±5°C. The optimum heating curve is shown below.
10 s max.
1 to 4°C/s
1 to 5°C/s
Do not apply additional force to the plunger once it has stopped moving. Do not repeatedly press the plunger off-center or from an acute angle. B3S Switches are designed to allow submersed washing after soldering. When washing, follow the guidelines given below: 1. Clean with alcohol solvents. Do not use chlorine solvents or water. 2. When using ultrasonic cleaning in two- or three-tank systems and do not clean for more than one minute at a time or for more than three minutes total. 3. Do not apply external force to the Switch while washing. 4. Do not wash immediately after soldering. If possible, allow components to stand for at least three minutes before washing. 5. The Switch cannot be used where subject to direct contact with water.
Normal temperature
Temperature % ( C)
60 to 90 s
20 s
30 s max.
Time (s) Note: The above heating curve applies if the thickness of the circuit board is 1.6 mm.
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B3S
Key Switch Packing
Key Switches are packed on tape as shown below.
Top tape Material: PET 330 dia. 13 dia. 21.5
B3S
Carrier tape (Material: PS+butadiene) www.datasheet4u.com
Tape reel
Label
Pitch: 12±0.1 1.5 dia.+0.1/0 Pitch: 4±0.1 1.75 7.5 8.7 7 1.5 9.4 0.06 Tape drawing direction 0.4 16 2
Standard Package Heat resistance Note:
Conforms to EIAJ standards 1,000 Key Switches 60°C for 24 hours (without deformation)
The ground terminals of the Key Switches are on the guidehole side of the package.
ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.
To convert millimeters into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527.
Cat. No. C108-E1-1
In the interest of product improvement, specifications are subject to change without notice.
OMRON Corporation
Control Components Division H.Q. 28th Fl., Crystal Tower Bldg. 1-2-27, Shiromi, Chuo-ku, Osaka 540 Japan Phone: 06-949-6115 Fax: 06-949-6134 Printed in Japan 0697-1M (0697) a
4.7
5
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