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MT6L05FS Dataheets PDF



Part Number MT6L05FS
Manufacturers Toshiba Semiconductor
Logo Toshiba Semiconductor
Description VHF-UHF Band Low-Noise Amplifier Applications
Datasheet MT6L05FS DatasheetMT6L05FS Datasheet (PDF)

MT6L05FS TOSHIBA Transistor Silicon NPN Epitaxial Planar Type MT6L05FS VHF~UHF Band Low-Noise Amplifier Applications Two devices are incorporated in a fine-pitch, small-mold package (6 pins): fS6. Unit: mm 1.0±0.05 0.1±0.05 0.35 0.35 0.8±0.05 0.1±0.05 0.15±0.05 1.0±0.05 0.7±0.05 z Superior noise characteristics z Superior performance in buffer and oscillator applications. 1 2 3 6 5 4 0.1±0.05 www.DataSheet4U.com Mounted Devices MT3S05T (MT3S05FS) Corresponding three-pin products:TESM(f.

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MT6L05FS TOSHIBA Transistor Silicon NPN Epitaxial Planar Type MT6L05FS VHF~UHF Band Low-Noise Amplifier Applications Two devices are incorporated in a fine-pitch, small-mold package (6 pins): fS6. Unit: mm 1.0±0.05 0.1±0.05 0.35 0.35 0.8±0.05 0.1±0.05 0.15±0.05 1.0±0.05 0.7±0.05 z Superior noise characteristics z Superior performance in buffer and oscillator applications. 1 2 3 6 5 4 0.1±0.05 www.DataSheet4U.com Mounted Devices MT3S05T (MT3S05FS) Corresponding three-pin products:TESM(fSM) mold products 0.48 -0.04 fS6 +0.02 Q1/Q2 Absolute Maximum Ratings (Ta = 25°C) Characteristic Collector- base voltage Collector- emitter voltage Emitter- base voltage Collector current Base current Collector power dissipation Junction temperature Storage temperature range Note: Symbol VCBO VCEO VEBO IC IB PC(Note 1) Tj Tstg Rating 10 5 2 40 10 100 110 (Note 2) 125 −55~125 Unit V V V mA mA mW °C °C 1. Collector1 (C1) 2. Emitter1 (E1) 3. Collector2 (C2) 4. Base2 (B2) 5. Emitter2 (E2) 6. Base1 (B1) JEDEC JEIAJ Toshiba ― ― 2-1F1A Weight: 0.001g (typ.) Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 2 Note 1: 10 mm × 1.0 mm (t), mounted on a glass-epoxy printed circuit board. Note 2: During two-element operation Marking (top view) 6 5 4 Pin Assignment (top view) 6 5 4 32 1 2 3 Q1 1 2 Q2 3 1 2007-11-01 MT6L05FS Electrical Characteristics Q1/Q2 (Ta = 25°C) Characteristic Collector cutoff current Emitter cutoff current DC current gain Reverse transfer capacitance Transition frequency Insertion gain Noise figure www.DataSheet4U.com Symbol ICBO IEBO hFE Cre (Note) fT ⎪S21e⎪ (1) ⎪S21e⎪ (2) 2 2 Condition VCB = 5 V, IE = 0 VEB = 1 V, IC = 0 VCE = 1 V, IC = 5 mA VCB = 1 V, IE = 0, f = 1 MHz VCE = 1 V, IC = 5 mA VCE = 1 V, IC = 5 mA, f = 1 GHz VCE = 3 V, IC = 20 mA, f = 1 GHz VCE = 1 V, IC = 5 mA, f = 1 GHz Min ⎯ ⎯ Typ. ⎯ ⎯ ⎯ Max 0.1 1 140 1.15 ⎯ ⎯ ⎯ Unit μA μA 80 ⎯ 0.9 4.5 8.5 11.5 1.4 pF GHz dB dB 2 ⎯ 8.5 ⎯ NF 2.2 Note: Cre is measured with a three-terminal method using a capacitance bridge. Caution This device is sensitive to electrostatic discharge. Ensure that tools and equipment are sufficiently grounded before handling. When handling individual devices (which are not yet mounted on a circuit board), ensure that the environment is protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that come into direct contact with devices should be made of antistatic materials. 2 2007-11-01 MT6L05FS www.DataSheet4U.com RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 20070701-EN GENERAL • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstrea.


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