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W7G1M32SVx-BN Dataheets PDF



Part Number W7G1M32SVx-BN
Manufacturers White Electronic Designs
Logo White Electronic Designs
Description Boot Sector Flash Memory Module
Datasheet W7G1M32SVx-BN DatasheetW7G1M32SVx-BN Datasheet (PDF)

White Electronic Designs W7G1M32SVx-BN W7G21M32SVx-BN PRELIMINARY* 8MB/4MB (2x1Mx32 / 1Mx32) CMOS, Boot Sector Flash Memory Module DESCRIPTION The W7G1M32SVx-BN and W7G21M32SVx-BN are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29LV160DT - 1Mx16 or STs M29W160ET (optional) Flash device in TSOP packages which are mounted on an FR4 substrate. Both modules offer access times between 70 and 120ns allowing for operation of high-speed microprocessors www.Dat.

  W7G1M32SVx-BN   W7G1M32SVx-BN



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White Electronic Designs W7G1M32SVx-BN W7G21M32SVx-BN PRELIMINARY* 8MB/4MB (2x1Mx32 / 1Mx32) CMOS, Boot Sector Flash Memory Module DESCRIPTION The W7G1M32SVx-BN and W7G21M32SVx-BN are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29LV160DT - 1Mx16 or STs M29W160ET (optional) Flash device in TSOP packages which are mounted on an FR4 substrate. Both modules offer access times between 70 and 120ns allowing for operation of high-speed microprocessors www.DataSheet4U.com without wait states. Embedded Erase Algorithms • Automatically preprograms and erases the chip or any combination of sectors Embedded Program Algorithms • Automatically programs and verifies data at specified address Data Polling and Toggle Bit feature for detection of program or erase cycle completion Low Power Dissipation • 30mA per Device Active Current • 10µA per Device CMOS Standby Current Single 3.3V ±10% Supply CMOS and TTL Compatible Inputs and Outputs Commercial and industrial operating temperature range • BNC = 0°C to 70°C Commercial • BNI = -40°C to 85°C Industrial Package • 80 Pin SIMM (JEDEC) Standard * This product is under development, is not qualified or characterized and is subject to change without notice. FEATURES 1Mx32 and 2x1Mx32 Densities Based on AMD – AM29LV160DT Flash Device STs M29W160ET (optional) Fast Read Access Time – 70ns 3.3V Only Reprogramming Flexible, Sector Architecture • One 16Kbyte, two 8Kbyte, one 32Kbyte and thirty-one 64Kbyte sectors. • Any combination of sectors can be erased • Also supports full chip erase Top boot block configurations • Bottom boot block optional. Contact WEDC. FIG. 1 – BLOCK DIAGRAMS W7G1M32SVx-BN: 1Mx32 80 PIN SIMM WE2# 1Mx16 WE# DQ0-15 CE# CE# Addr 0-19 W7G21M32SVx-BN: 2x1Mx32 80 PIN SIMM WE2# 1Mx16 WE# DQ0-15 CE# CE# Addr 0-19 1Mx16 WE# DQ0-15 1Mx16 WE# CE# CE# Addr 0-19 DQ16-31 DQ16-31 WE0# 1Mx16 WE# DQ0-15 CE# CE# WE0# DQ0-15 CE# CE# DQ0-15 Addr 0-19 1Mx16 WE# DQ0-15 CE# CE# DQ0-15 Addr 0-19 CE0# CE0# CE1# OE# Addr 0-19 OE# Addr 0-19 Addr 0-19 Feb. 2004 Rev. 2 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs W7G1M32SVx-BN W7G21M32SVx-BN PRELIMINARY FIGURE 2 – DECOUPLING CAPACITORS ARE PROVIDED FOR IMPROVED NOISE IMMUNITY. VCC 1 1 1 1 1 1 1 C1 .1 µF 2 C2 .1 µF 2 C3 .1 µF 2 C4 .1 µF 2 C5 .1 µF 2 C6 .1 µF 2 C7 .1 µF 2 C8 .1 µF 2 www.DataSheet4U.com Notes: Unless otherwise specified. 1. Population Configuration for 1M x 32 Version Part Number Configuration W7G1M32SVxxxBNX 1M x 32 2. Population Configuration for 2 x 1M x 32 Version Part Number Configuration W7G21M32SVxxxBNX 2 x 1M x 32 xx = Speed: 70, 90, 120ns X = Temerature Range Please refer to part number matrix pg. 8 or 9 Component 1M x 8 Component 1M x 8 Feb. 2004 Rev. 2 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com 1 White Electronic Designs W7G1M32SVx-BN W7G21M32SVx-BN PRELIMINARY FIGURE 3 – W7G1M32SVxxxBNX & W7G21M3.


W29NK50Z W7G1M32SVx-BN W7G21M32SVx-BN


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