DatasheetsPDF.com

A82DL1624U

AMIC Technology

(A82DL16x4U) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM

A82DL16x4T(U) Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bi...


AMIC Technology

A82DL1624U

File Download Download A82DL1624U Datasheet


Description
A82DL16x4T(U) Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) Static RAM Preliminary www.DataSheet4U.com Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) Static RAM Revision History Rev. No. 0.0 History Initial issue Issue Date August 15, 2005 Remark Preliminary PRELIMINARY (August, 2005, Version 0.0) AMIC Technology, Corp. A82DL16x4T(U) Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) Static RAM Preliminary www.DataSheet4U.com DISTINCTIVE CHARACTERISTICS MCP Features Single power supply operation 2.7 to 3.6 volt High Performance - Access time as fast as 70ns Package 69-Ball TFBGA (8x11x1.4 mm) Industrial operating temperature range: -40°C to 85°C for –U; -25°C to 85°C for –I - Suspends erase operations to allow programming in same bank Data Polling and Toggle Bit - Provides a software method of detecting the status of program or erase cycles Unlock Bypass Program command - Reduces overall programming time when issuing multiple program command sequences HARDWARE FEATURES Any combination of sectors can be erased Ready/ Busy output (RY/ BY ) - Hardware metho...




Similar Datasheet




@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)