Connector
High Reliability, Military D Subminature, & Non-Magnetic/No-Outgas
Solder Cup Crimp Printed Circuit
(See page 333)
(Se...
Description
High Reliability, Military D Subminature, & Non-Magnetic/No-Outgas
Solder Cup Crimp Printed Circuit
(See page 333)
(See page 334-335)
(See page 336-338)
Performance and Material Specifications
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Shell
MATERIALS AND FINISHES
Standard Material Steel per ASTM A-620 Finish Yellow chromate over cadmium QQ-P-416 Type II Class 2 Material Steel per ASTM A-620 Miltary Finish Yellow chromate over cadmium QQ-P-416 Type II Class 2
Insulator
Diallyl phthalate glass-filled per MIL-M-14, type SDG-F, color green Copper alloy Gold over nickel
Diallyl phthalate glass-filled per MIL-M-14, type SDG-F, color green Copper Alloy Crimp Socket has stainless steel hood passivated. Stainless steel Gold 50 microinches minimum thickness per MIL-G-45204 Type II Grade C Class 1 over copper per MIL-C-14550 Hood: Passivated Passivate per QQ-P-35
Contact
Float Mount Hardware
Stainless steel
Passivate per QQ-P-35
PERFOMANCE SPECIFICTIONS
Wire Accommodation (AWG) Solder - #20 Max. Crimp - #18- #30 Max. #20; 5 Amp -65˚C to +150˚C 55 @ 7.5 Amp test current
DIELECTRIC WITHSTANDING VOLTAGE
90˚ and Straight (Solder/Crimp) Altitude (feet/m) Sea Level Average Flashover Test 1700/1500 1250/1000 20,000/6,096 1000/1000 750/650 50,000/15,240 650/500 475/325 70,000/21,336 500/500 375/325
Current Rating Temperature Rating Contact Resistance After Salt Spray, Millivolt Max.
See pages 339 and 340 for complete M24308 cross reference.
All voltage figures are rms AC 60 rms cps, measured at appr...
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