Document
FBI1.5A4S1.......FBI1.5M4S1
1.5 Amp. Glass Passivated Bridge Rectifier
Dimensions in mm.
20 3.5
Plastic Case
Voltage 50 to 1000 V.
Current 1.5 A.
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®
_
0.8 + 0.05
+
• Glass Passivated Junction Chips.
L 13.5 7 suffix –4
1
• UL recognized under component index file number E130180.
0.5
4
4
4
• Lead and polarity identifications. • Case: Molded Plastic. • Ideal for printed circuit board (P .C.B.). • The plastic material carries U/L recognition 94 V-O.
• Mounting Instructions
• High temperature soldering guaranteed: 260 ºC – 10 sc. • Recommended mounting torque: 8 Kg.cm.
Maximum Ratings, according to IEC publication No. 134
FBI1.5A FBI1.5B 4S1 4S1 FBI1.5D 4S1 FBI1.5G 4S1 FBI1.5J 4S1 FBI1.5K FBI1.5M 4S1 4S1
VRRM VRMS IF(AV) IFSM I2t VDIS Tj Tstg
Peak recurrent reverse voltage (V) Maximum RMS voltage (V) Max. Average forward current with heatsink without heatsink 8.3 ms. peak forward surge current
(Jedec Method)
50 35
100 70
200 140
400 280
600 420
800 560
1000 700
4.0 A at 65 ºC 1.5 A at 25 ºC 50 A 10 A2 sec 1500 V – 55 to + 150 °C – 55 to +150 ºC
Rating for fusing ( t<8.3 ms.) Dielectric strength (terminals to case, AC 1 min.) Operating temperature range Storage temperature range
Electrical Characteristics at Tamb = 25°C
VF IR Max. forward voltage drop per element at IF = 1 A
Max. reverse current per element at VRRM
1.0 V 5 A 12 ºC/W 45 ºC/W
Jan - 00
MAXIMUM THERMAL RESISTANCE R th (j-c) Junction-Case. With Heatsink. Rth (j-a) Junction-Ambient. Without Heatsink.
FBI1.5 - 4S1 Characteristic Curves
TYPICAL FORWARD CHARACTERISTIC Tamb = 25° C FORWARD CURRENT DERATING CURVE
10
4
heatsink Tc
Tc
_
+
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3
on glass-epoxi substrate
1.0
_ +
sine wave R-load on heatsink
2 0.1 1
P.C.B. soldering land 5 mm ø sine wave R-load free in air
0 0.6 1.0 1.4
VF , instantaneous forward voltage (V)
0 0 25 50 75 100 125 150 175
Tamb, ambient temperature (°C)
MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT
60 50 40 30 20 10 0 1 10
Number of cycles at 60 Hz.
100
Jan - 00
.