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SIGC158T170R3

Infineon Technologies
Part Number SIGC158T170R3
Manufacturer Infineon Technologies
Description IGBT
Published Sep 15, 2007
Detailed Description www.DataSheet4U.com Preliminary SIGC158T170R3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-of...
Datasheet PDF File SIGC158T170R3 PDF File

SIGC158T170R3
SIGC158T170R3

Overview
www.
DataSheet4U.
com Preliminary SIGC158T170R3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling 3 This chip is used for: • power module C Applications: • drives G E Chip Type SIGC158T170R3 VCE ICn Die Size 12.
57 x 12.
57 mm2 Package sawn on foil Ordering Code Q67050A4227-A101 1700V 125A MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metalization Collector metalization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 12.
57 ...


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