Molded Chip Wirewound Inductors
Molded Chip Wirewound Inductors
FEATURES
• • • • • EIA SIZES A (1210), B (1812) AND C (1008) EXCELLENT HIGH Q AND HIGH S...
Description
Molded Chip Wirewound Inductors
FEATURES
EIA SIZES A (1210), B (1812) AND C (1008) EXCELLENT HIGH Q AND HIGH SRF CHARACTERISTICS includes all homogeneous materials BOTH FLOW AND REFLOW SOLDERING APPLICABLE *See Part Number System for Details HIGH INDUCTANCE AVAILABLE IN SMALL SIZE EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE
NIN Series
RoHS Compliant
AVAILABLE TYPE AND RANGE
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SPECIFICATIONS
Specifications Inductance Range Inductance Tolerance Operating Temperature Range Insulation Resistance Withstanding Voltage Q-Factor, Self Resonant Frequency DC Resistance, Rated DC Current and Inductance Tolerance Case Size 1008 1210 1812 10nH ~ 100 µH 47nH ~ 330µH 0.10µH ~ 1000 µH ±20% (M), ±10% (K), ±5% (J) ±10% (K), ±5% (J) -25°C ~ +85°C (at 100% of rated voltage) 1,000 MegOhm Min. (@ 100Vdc, Termination to Case) 250 Vdc for 1 minute (Termination to Case) See Individual Product Listings
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ENVIRONMENTAL CHARACTERISTICS
Test Solderability Humidity Specification 90% Min. Coverage Test Method & Condition After 3 Sec. Dip in +230oC Solder Pot (Post Flux) After 500 Hrs at 60oC and 90 ~ 9...
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