Document
CYStech Electronics Corp.
80V/100mA SURFACE MOUNT SWITCHING DIODE
Spec. No. : C332SY Issued Date : 2004.04.16 Revised Date : Page No. : 1/1
CASD355SY
Features:
● Designed for mounting on small surface ● Extremely thin / leadless package ● Low leakage current ● High mounting capability, strong surge withstand, high reliability
Mechanical data:
● Case: 1005(2512) standard package, molded plastic, JEDEC SOD-323 ● Terminals : Gold plated, solderable per MIL-STD-750, method 2026. ● Polarity: Indicated by cathode band ● Mounting position: Any ● Weight: 0.006 gram (approximately)
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Absolute Maximum Ratings(At Ta=25℃, unless otherwise noted)
Characteristics Repetitive Peak Reverse Voltage Reverse Voltage Average Forward Current Peak Forward Surge Current @8.3ms, single half sine-wave superimposed on rated load(JEDEC method) Repetitive Peak Forward Current Power Dissipation Junction Temperature Storage Temperature Range Symbol VRRM VR IO IFSM IFRM PD Tj Tstg Min -55 -55 Typ 1000 Max 90 80 100 225 300 +125 +125 Unit V V mA mA mA mW °C °C
Electrical Characteristics ( At Ta=25°C, unless otherwise noted)
Parameter Forward Voltage Reverse Current Diode Capacitance Reverse Recovery Time Conditions IF=100mA VR=80V VR=0.5V, f=1MHz IF=10mA,VR=6V,IRR=0.1×IR, RL=50Ω Symbol VF IR CD trr Min Typ Max 1 100 3 4 Unit V nA pF ns
CASD355SY
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Spec. No. : C332SY Issued Date : 2004.04.16 Revised Date : Page No. : 2/2
Reverse Leakage Current vs Temperature
Forward Current vs Forward Voltage 1000
Reverse Leakage Current---IR(nA) 10000 125℃ 1000 75℃ 100 25℃ 10
Forward Current---IF(mA)
100
125℃ 75℃ 25℃ -25℃
10
1 0 0.2 0.4 0.6 0.8 1 1.2 Forward Voltage---VF(V) Diode Capacitance vs Reverse Voltage
5
1 0 10 20 30 40 50 60 70 80 Ambient Temperature---TA(℃)
Forward Current vs Ambient Temperature
125
Percentage of Peak Average Forward Current(%)
Diode Capacitance---CD(pF)
4 3 2 1 0 0 2 4 6 8
f=1MHz Ta=25℃
Mounting on glass epoxy PCBs 100 75 50 25 0
10
12
14
0
25
50
75
100
125
150
Reverse Voltage---VR(V)
Ambient Temperature---Ta(℃)
CASD355SY
CYStek Product Specification
CYStech Electronics Corp.
SOD-323(1005) Dimension
Spec. No. : C332SY Issued Date : 2004.04.16 Revised Date : Page No. : 3/3
SOD-323(1005) Plastic Surface Mounted Package CYStek Package Code : SY
*:Typical
DIM A B C
Inches Min. Max. 0.095 0.102 0.043 0.051 0.014(typ)
Millimeters Min. Max. 2.4 2.6 1.1 1.3 0.35(typ)
DIM D E F
Inches Min. Max. 0.027 0.035 0.012(typ) 0.014(typ)
Millimeters Min. Max. 0.7 0.9 0.30(typ) 0.35(typ)
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy res.