MF1ICS5005

www.DataSheet4U.com INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Specification “bumped sawn wafer on UV-tape” Product Specification Revision 3.0 PUBLIC August 2004 Philips Semiconductors Philips Semiconductors Product Specification Rev. 3.0 August 2004 Bumped sawn wafer on UV-tape Standard Card IC MF1 IC S50 05 CONTENTS 1 2 2.1 3 3.1 3.2 3.3 3.4 3.5 4 4.1 5 6 6.1 6.2 7 8 9 SCOPE............................................................................................................................. 3 REFERENCE DOCUMENTS.............................................................................................. 3 Philips Documents............................................................................................................. 3 MECHANICAL SPECIFICATION ........................................................................................ 3 Wafer................................................................................................................................ 3 Wafer Backside ................................................................................................................. 3 Chip Dimensions ............................................................................................................... 3 Passivation........................................................................................................................ 3 Au Bump.......................................................................