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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by MURHB840CT/D
Designer's
SWITCHMODE
™
Data Sheet
D2PAK Power Surface Mount Package
™ Power Rectifier
MURHB840CT
Motorola Preferred Device
Designed for use in switching power supplies, inverters and as free wheeling diodes, these state–of–the–art devices have the following features: • Package Designed for Power Surface Mount Applications • Ultrafast 28 Nanosecond Recovery Times • 175°C Operating Junction Temperature • Epoxy Meets UL94, VO @ 1/8″ • High Temperature Glass Passivated Junction • High Voltage Capability • Low Leakage Specified @ 150°C Case Temperature • Short Heat Sink Tab Manufactured — Not Sheared! • Similar in Size to Industry Standard TO–220 Package Mechanical Characteristics • Case: Epoxy, Molded 3 • Weight: 1.7 grams (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • Shipped 50 units per plastic tube • Available in 24 mm Tape and Reel, 800 units per reel by adding a “T4” suffix to the part number • Marking: UH840
1 4
ULTRAFAST RECTIFIER 8.0 AMPERES 400 VOLTS
4 1 3 CASE 418B–02 D2PAK
MAXIMUM RATINGS, PER LEG
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR), TC = 120°C Total Device Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz), TC = 120°C Non–repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Controlled Avalanche Energy Operating Junction Temperature and Storage Temperature IFM IFSM WAVAL TJ, Tstg Symbol VRRM VRWM VR IF(AV) Value 400 Unit Volts
4.0 8.0 8 100 20 – 65 to +175
Amps Amps Amps mJ °C
THERMAL CHARACTERISTICS, PER LEG
Maximum Thermal Resistance — Junction to Case — Junction to Ambient (1) (1) See Chapter 7 for mounting conditions RθJC RθJA 3.0 50 °C/W
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
Designer’s and SWITCHMODE are trademarks of Motorola, Inc. Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value. Rev 1
Device ©Rectifier Motorola, Inc. 1996 Data
1
MURHB840CT
ELECTRICAL CHARACTERISTICS, PER LEG
Characteristic Maximum Instantaneous Forward Voltage (2) Maximum Instantaneous Reverse Current (2) Maximum Reverse Recovery Time (IF = 1.0 Amp, di/dt = 50 Amps/µs) (2) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0% (iF = 4.0 Amps, TC = 150°C) (iF = 4.0 Amps, TC = 25°C) (Rated dc Voltage, TC = 150°C) (Rated dc Voltage, TC = 25°C) Symbol vF iR trr Max 1.9 2.2 500 10 28 Unit Volts µA ns
i F, INSTANTANEOUS FORWARD CURRENT (AMP)
100 50 IR, REVERSE CURRENT ( µA) 20 10 5 2 1 0.5 0.2 0.1 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 25°C 100°C TJ = 150°C
1000 500 200 100 50 20 10 5 2 1 0.5 0.2 0.1
TJ = 150°C 100°C
25°C
0
50
100
150
200
250
300
350
400
vF, INSTANTANEOUS VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Typical Reverse Current, Per Leg
I F, AVERAGE POWER DISSIPATION (WATTS)
10 RATED VR APPLIED RθJC = 3°C/W C, CAPACITANCE (pF) 170 180
1000
8
100
6
DC SQUARE WAVE
4 2
10
0 110
120
130 140 150 160 TC, CASE TEMPERATURE (°C)
1 0.01
0.1 1 10 VR, REVERSE VOLTAGE (VOLTS)
100
Figure 3. Current Derating, Case
Figure 4. Typical Capacitance, Per Leg
2
Rectifier Device Data
MURHB840CT
PF(AV) , AVERAGE POWER DISSIPATION (WATTS) 20 18 16 14 12 10 8 6 4 2 0 1 2 3 4 5 6 7 8 IF(AV), AVERAGE FORWARD CURRENT (AMPS) 9 10 TJ = 175°C SQUARE WAVE DC
Figure 5. Forward Power Dissipation, Per Leg
INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface
0.74 18.79
between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.065 1.651 0.420 10.66 0.07 1.78 0.14 3.56
inches mm
0.330 8.38
D2PAK POWER DISSIPATION
The power dissipation of the D2PAK is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the D2PAK package, PD can be calculated as follows: PD = TJ(ma.