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MURHB840CT Dataheets PDF



Part Number MURHB840CT
Manufacturers Motorola
Logo Motorola
Description ULTRAFAST RECTIFIER
Datasheet MURHB840CT DatasheetMURHB840CT Datasheet (PDF)

www.DataSheet4U.com MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MURHB840CT/D Designer's SWITCHMODE ™ Data Sheet D2PAK Power Surface Mount Package ™ Power Rectifier MURHB840CT Motorola Preferred Device Designed for use in switching power supplies, inverters and as free wheeling diodes, these state–of–the–art devices have the following features: • Package Designed for Power Surface Mount Applications • Ultrafast 28 Nanosecond Recovery Times • 175°C Operating Junction Te.

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www.DataSheet4U.com MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MURHB840CT/D Designer's SWITCHMODE ™ Data Sheet D2PAK Power Surface Mount Package ™ Power Rectifier MURHB840CT Motorola Preferred Device Designed for use in switching power supplies, inverters and as free wheeling diodes, these state–of–the–art devices have the following features: • Package Designed for Power Surface Mount Applications • Ultrafast 28 Nanosecond Recovery Times • 175°C Operating Junction Temperature • Epoxy Meets UL94, VO @ 1/8″ • High Temperature Glass Passivated Junction • High Voltage Capability • Low Leakage Specified @ 150°C Case Temperature • Short Heat Sink Tab Manufactured — Not Sheared! • Similar in Size to Industry Standard TO–220 Package Mechanical Characteristics • Case: Epoxy, Molded 3 • Weight: 1.7 grams (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • Shipped 50 units per plastic tube • Available in 24 mm Tape and Reel, 800 units per reel by adding a “T4” suffix to the part number • Marking: UH840 1 4 ULTRAFAST RECTIFIER 8.0 AMPERES 400 VOLTS 4 1 3 CASE 418B–02 D2PAK MAXIMUM RATINGS, PER LEG Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR), TC = 120°C Total Device Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz), TC = 120°C Non–repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Controlled Avalanche Energy Operating Junction Temperature and Storage Temperature IFM IFSM WAVAL TJ, Tstg Symbol VRRM VRWM VR IF(AV) Value 400 Unit Volts 4.0 8.0 8 100 20 – 65 to +175 Amps Amps Amps mJ °C THERMAL CHARACTERISTICS, PER LEG Maximum Thermal Resistance — Junction to Case — Junction to Ambient (1) (1) See Chapter 7 for mounting conditions RθJC RθJA 3.0 50 °C/W Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design. Designer’s and SWITCHMODE are trademarks of Motorola, Inc. Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. Rev 1 Device ©Rectifier Motorola, Inc. 1996 Data 1 MURHB840CT ELECTRICAL CHARACTERISTICS, PER LEG Characteristic Maximum Instantaneous Forward Voltage (2) Maximum Instantaneous Reverse Current (2) Maximum Reverse Recovery Time (IF = 1.0 Amp, di/dt = 50 Amps/µs) (2) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0% (iF = 4.0 Amps, TC = 150°C) (iF = 4.0 Amps, TC = 25°C) (Rated dc Voltage, TC = 150°C) (Rated dc Voltage, TC = 25°C) Symbol vF iR trr Max 1.9 2.2 500 10 28 Unit Volts µA ns i F, INSTANTANEOUS FORWARD CURRENT (AMP) 100 50 IR, REVERSE CURRENT ( µA) 20 10 5 2 1 0.5 0.2 0.1 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 25°C 100°C TJ = 150°C 1000 500 200 100 50 20 10 5 2 1 0.5 0.2 0.1 TJ = 150°C 100°C 25°C 0 50 100 150 200 250 300 350 400 vF, INSTANTANEOUS VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current, Per Leg I F, AVERAGE POWER DISSIPATION (WATTS) 10 RATED VR APPLIED RθJC = 3°C/W C, CAPACITANCE (pF) 170 180 1000 8 100 6 DC SQUARE WAVE 4 2 10 0 110 120 130 140 150 160 TC, CASE TEMPERATURE (°C) 1 0.01 0.1 1 10 VR, REVERSE VOLTAGE (VOLTS) 100 Figure 3. Current Derating, Case Figure 4. Typical Capacitance, Per Leg 2 Rectifier Device Data MURHB840CT PF(AV) , AVERAGE POWER DISSIPATION (WATTS) 20 18 16 14 12 10 8 6 4 2 0 1 2 3 4 5 6 7 8 IF(AV), AVERAGE FORWARD CURRENT (AMPS) 9 10 TJ = 175°C SQUARE WAVE DC Figure 5. Forward Power Dissipation, Per Leg INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface 0.74 18.79 between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.065 1.651 0.420 10.66 0.07 1.78 0.14 3.56 inches mm 0.330 8.38 D2PAK POWER DISSIPATION The power dissipation of the D2PAK is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the D2PAK package, PD can be calculated as follows: PD = TJ(ma.


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