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SEMICONDUCTOR TECHNICAL DATA
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The RF Line
NPN Silicon
MRF16030
30 WATTS, 1.6 GHz RF POWER TRANSISTOR NPN SILICON
RF Power Transistor
Designed for 28 Volt microwave large–signal, common base, Class–C CW amplifier applications in the range 1600 – 1640 MHz. • Specified 28 Volt, 1.6 GHz Class–C Characteristics Output Power = 30 Watts Minimum Gain = 7.5 dB, @ 30 Watts Minimum Efficiency = 40% @ 30 Watts • Characterized with Series Equivalent Large–Signal Parameters from 1500 MHz to 1700 MHz • Silicon Nitride Passivated • Gold Metallized, Emitter Ballasted for Long Life and Resistance to Metal Migration
CASE 395C–01, STYLE 2
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating Collector–Emitter Voltage Emitter–Base Voltage Collector–Current Total Device Dissipation @ TC = 25°C Derate above 25°C Storage Temperature Range Symbol VCES VEBO IC PD Tstg Value 60 4.0 4.0 103 0.58 – 65 to +150 Unit Vdc Vdc Adc Watts °C/W °C
THERMAL CHARACTERISTICS
Thermal Resistance — Junction to Case (1) (2) RθJC 1.7 °C/W (1) Thermal measurement performed using CW RF operating condition. (2) Thermal resistance is determined under specified RF operating conditions by infrared measurement techniques.
REV 3
1
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage (IC = 100 mAdc, VBE = 0) Collector–Base Breakdown Voltage (IC = 100 mAdc, IE = 0) Emitter–Base Breakdown Voltage (IE = 10 mAdc, IC = 0) Collector Cutoff Current (VCE = 28 Vdc, VBE = 0) V(BR)CES 55 V(BR)CBO 55 V(BR)EBO ICES — — 10 4.0 — — mAdc — — Vdc — — Vdc Vdc
ON CHARACTERISTICS
DC Current Gain (ICE = 1.0 Adc, VCE = 5.0 Vdc) hFE 20 35 80 —
FUNCTIONAL TESTS
Collector–Base Amplifier Power Gain (VCC = 28 Vdc, Pout = 30 Watts, f = 1600/1640 MHz) Collector Efficiency (VCC = 28 Vdc, Pout = 30 Watts, f = 1600/1640 MHz) Input Return Loss (VCC = 28 Vdc, Pout = 30 Watts, f = 1600/1640 MHz) Output Mismatch Stress VCC = 28 Vdc, Pout = 30 Watts, f = 1600 MHz, Load VSWR = 3:1, All phase angles at frequency of test Gpe 7.5 η 40 IRL 8.0 Ψ No Degradation in Output Power — — 45 — dB 7.7 — % dB
REV 3
2
L3 B1 28 Vdc C1 L2 C2 R1 C3 C4
L1
C5
Board Material – Teflon® Glass Laminate Dielectric Thickness = 0.30″, εr = 2.55″, 2.0 oz. Copper
B1 C1, C5 C2 C3
Fair Rite Bead on #24 Wire 100 pF, B Case, ATC Chip Cap 0.1 µF, Dipped Mica Cap 0.1 µF, Chip Cap
C4 L1, L2 L3 R1
47 µF, 50 V, Electrolytic 3 Turns, #18, 0.133″ ID, 0.15″ Long 9 Turns, #24 Enamel 82 Ω, 1.0 W, Carbon
Figure 1. MRF16030 Test Fixture Schematic
f = 1.5 GHz 1.7 GHz ZOL* 1.6 GHz Zin
1.6 GHz 1.7 GHz
f = 1.5 GHz Zo = 10 Ω
VCC = 28 Vdc, Pout = 30 W f MHz Zin Ohms ZOL* Ohms
1500 1600 1700
3.05 + j 4.88 4.32 + j 6.00 5.62 + j 5.79
2.66 + j 2.53 1.79 + j 2.80 1.51 + j 2.64
ZOL* = Conjugate of the optimum load impedance into which the device output operates at a given output power, voltage and frequency.
Figure 2. Ser.