Document
TD62164AP/AF
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62164AP,TD62164AF
4CH HIGH−CURRENT DARLINGTON SINK DRIVER
The TD62164AP and TD62164AF are high−voltage, high−current darlington drivers comprised of four NPN darlington pairs. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer, lamp and stepping moter drivers. Please observe the thermal condition for using.
FEATURES
Output current (single output) 700 mA (max) High sustaining voltage output 50 V (min) Output clamp diodes Input compatible with TTL and 5−V CMOS GND and SUB terminal heat sink Package type−AP : DIP−16 pin Package type−AF : HSOP−16 pin
PIN CONNECTION (TOP VIEW)
TD62164AP
Weight DIP16-P-300-2.54A: 1.11 g (typ.) HSOP16-P-300-1.00: 0.50 g (typ.)
TD62164AF
SCHEMATICS (EACH DRIVER)
Note: The input and output parasitic diodes cannot be used as clamp diodes.
1 2006-06-14
ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
TD62164AP/AF
CHARACTERISTIC
SYMBOL
RATING
Supply Voltage Output Sustaining Voltage Output Current Input Current Input Voltage Clamp Diode Reverse Voltage Clamp Diode Forward Current
Operating Temperature
AP AF
Operating Temperature Storage Temperature
VCC VCE (SUS)
IOUT IIN VIN VR IF
PD
Topr Tstg
−0.5~17 −0.5~50
700 50 17 50 700 1.47 / 2.7 (Note 1) 0.9 / 1.4 (Note 2) −40~85 −55~150
Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 50%) Note 2: On Glass Epoxy PCB (60 × 60 × 1.6 mm Cu 30%)
UNIT V V
mA / ch mA V V mA
W
°C °C
RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C)
CHARACTERISTIC
SYMBOL
CONDITION
MIN TYP. MAX UNIT
Supply Voltage Output Sustaining Voltage
Output Current
AP AF
Input Voltage
Output On
Output Off
Input Current
Clamp Diode Reverse Voltage
Clamp Diode Forward Current
Power Dissipation
AP AF
VCC VCE (SUS)
DC 1 Circuit, Ta = 25°C
4.5 ― 5.5 V 0 ― 50 V 0 ― 570
IOUT
Tpw = 25 ms 4 Circuit Ta = 85°C
Duty = 10% Duty = 50% Duty = 10%
0 0 0
― 570
570
mA / ch
― 570
Tj = 120°C
Duty = 50%
0
― 480
VIN 0 ― 15 V
VIN (ON) IOUT = 500 mA
VIN (OFF) IIN VR IF
PD
Ta = 85°C Ta = 85°C
hFE = 150
10.0 ―
15
hFE = 2000
2.4
―
15
V
0 ― 0.4
0 ― 20 mA
― ― 50 V
― ― 500 mA
(Note 1) (Note 2)
― ―
― 1.4 W
― 0.7
Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 50%) Note 2: On Glass Epoxy PCB (60 × 30 × 1.6 mm Cu 30%)
2 2006-06-14
ELECTRICAL CHARACTERISTICS (Ta = 25°C)
CHARACTERISTIC
Output Leakage Current
Collector−Emitter Saturation Voltage DC Current Transfer Ratio Input Voltage (Output On)
Clamp Diode Reverse Current Clamp Diode Forward Voltage
Output On Supply Current
Output Off Input Capacitance Turn−On Delay Turn−Off Delay
SYMBOL
ICEX
VCE (sat) hFE
VIN (ON)
IR VF ICC (ON) ICC (OFF) CIN tON tOFF
TEST CIR− CUIT
TEST CONDITION
1 VCE = 50 V, Ta = 25°C VCE = 50 V, Ta = 85°C
2 IOUT = 500 mA, VCC = 5 V IOUT = 200 mA, VCC = 5 V
2 VCE = 2 V, IOUT = 500 mA
3 IOUT = 500 mA, hFE = 150 IOUT = 500 mA, hFE = 2000
4 VR = 50 V, Ta = 25°C VR = 50 V, Ta = 85°C
5 IF = 500 mA
6 VCC = 5.5 V, VIN = 2.4 V VCC = 5.5 V, VIN = 0.4 V
― VIN = 0, f = 1 MHz
7
VOUT = 50 V, RL = 72 Ω VCC = 5.0 V, CL = 15 pF
TEST CIRCUIT 1. ICEX
2. hFE, VCE (sat)
3. VIN (ON)
TD62164AP/AF
MIN TYP. MAX UNIT
― ― 50 µA
― ― 100
― ― 0.8 V
― ― 0.45
2000 ―
―
7.0 ― 10.0 V
1.8 ― 2.4
― ― 50 µA
― ― 100
― ― 2.0 V
― 35 40 mA / ch
― ― 10 µA
― 15 ― pF
― 0.2 0.4 µs
― 4.0 8.0
4. IR
5. VF
HFE
=
IOUT IIN
6. ICC (ON), ICC (OFF)
7. tON, tOFF
Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, tr ≤ 5ns, tf ≤ 10 ns
Note 2: CL includes probe and jig capacitance.
PRECAUTIONS for USING
This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, VCC, COMMON and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
3 2006-06-14
TD62164AP/AF
4 2006-06-14
TD62164AP/AF
5 2006-06-14
PACKAGE DIMENSIONS
DIP16−P−300−2.54A
TD62164AP/AF
Unit : mm
Weight: 1.11 g (typ.)
6 2006-06-14
PACKAGE DIMENSIONS
HSOP16−P−300−1.00
TD62164AP/AF
Unit : mm
Weight: 0.50 g (typ.)
7 2006-06-14
TD62164AP/AF
Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the devi.