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STY34NB50F

ST Microelectronics

N-CHANNEL Power MOSFET

® STY34NB50F N - CHANNEL 500V - 0.11Ω - 34 A - Max247 PowerMESH™ MOSFET TYPE STY34NB50F s s s s s s s V DSS 500 V R ...


ST Microelectronics

STY34NB50F

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Description
® STY34NB50F N - CHANNEL 500V - 0.11Ω - 34 A - Max247 PowerMESH™ MOSFET TYPE STY34NB50F s s s s s s s V DSS 500 V R DS(on) < 0.14 Ω ID 34 A TYPICAL RDS(on) = 0.11 Ω EXTREMELY HIGH dv/dt CAPABILITY ± 30V GATE TO SOURCE VOLTAGE RATING 100% AVALANCHE TESTED LOW INTRINSIC CAPACITANCE GATE CHARGE MINIMIZED REDUCED VOLTAGE SPREAD 1 2 3 DESCRIPTION Using the latest high voltage MESH OVERLAY™ process, STMicroelectronics has designed an advanced family of power MOSFETs with outstanding performances. The new patent pending strip layout coupled with the Company’s proprietary edge termination structure, gives the lowest RDS(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switching characteristics. APPLICATIONS s HIGH CURRENT, HIGH SPEED SWITCHING s SWITCH MODE POWER SUPPLY (SMPS) s DC-AC CONVERTER FOR WELDING EQUIPMENT AND UNINTERRUPTABLE POWER SUPPLY AND MOTOR DRIVE ABSOLUTE MAXIMUM RATINGS Symb ol V DS V DGR V GS ID ID I DM ( ) P tot dv/dt (1) T s tg Tj Parameter Drain-source Voltage (VGS = 0) Drain- gate Voltage (RGS = 20 k Ω ) G ate-source Voltage Drain Current (continuous) at Tc = 25 o C Drain Current (continuous) at Tc = 100 o C Drain Current (pulsed) T otal Dissipation at Tc = 25 C Derating F actor Peak Diode Recovery voltage slope Storage Temperature Max. O perating Junction Temperature o Max247™ INTERNAL SCHEMATIC DIAGRAM Value 500 500 ± 30 34 21.4 136 450 3.61 4.5 -65 to 150 150 ( 1) ISD ≤34 A, di/dt ≤ 200 A/µs, VDD ≤ V(BR...




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