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SOT27-1

NXP
Part Number SOT27-1
Manufacturer NXP
Description Package outline
Published May 28, 2005
Detailed Description PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP14: plastic dual in-line package; 14 leads (300 mil) SOT2...
Datasheet PDF File SOT27-1 PDF File

SOT27-1
SOT27-1


Overview
PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 D seating plane ME A2 A L A1 c Z e b1 b 14 8 MH w M (e 1) pin 1 index E 1 7 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max.
4.
2 0.
17 A1 min.
0.
51 0.
02 A2 max.
3.
2 0.
13 b 1.
73 1.
13 0.
068 0.
044 b1 0.
53 0.
38 0.
021 0.
015 c 0.
36 0.
23 0.
014 0.
009 D (1) 19.
50 18.
55 0.
77 0.
73 E (1) 6.
48 6.
20 0.
26 0.
24 e 2.
54 0.
1 e1 7.
62 0.
3 L 3.
60 3.
05 0.
14 0.
12 ME 8.
25 7.
80 0.
32 0.
31 MH 10.
0 8.
3 0.
39 0.
33 w 0.
254 0.
01 Z (1) max.
2.
2 0.
087 Note 1.
Plastic or metal protrusions of 0.
25 mm (0.
01 inch) maximum per side ar...



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