SA1316

Semiconductor SA1316 Chip LED Lamp Features 1.6mm(L)×0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Applications LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp Outline Dimensions unit : mm KLA-9001-001 1 SA1316 Absolute maximum ratings Characteristic Power Dissipation Forward Current * Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature 2 1 Symbol PD IF IFP VR Topr Tstg Ratings 70 25 50 4 -25∼80 -30∼100 Unit mW mA mA V °C °C * Soldering Temperature Tsol 240°C for 5 seconds *1.Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended soldering Temperature Profile 2-1) Preheating 100°C to 150°C within 2 minutes Soldering 240°C within 5 seconds Gradual cooling (Avoid quenching) Electrical Characteristics Characteristic Forward Voltage Luminous Intensity Peak Wavelength Spectrum Bandwidth Reverse Current Half Angle Symbol VF IV Test Condition IF= 20mA IF= 20mA IF= 20mA IF= 20mA VR=4V Min - Typ 2.0 6 630 35 ±65 ±70 Max 2.8 10 - Unit V mcd nm nm uA deg λP ∆λ IR θ1/2 X Y IF= 20mA KLA-9001-001 2 SA1316 Characteristic Diagrams Fig. 1 IF - VF Fig. 2 IV - IF Forward Current IF [mA] Forward Voltage VF [V] Luminous Intensity Iv [mcd] Forward Current IF [mA] Fig. 3 IF – Ta Fig.4 Spectrum Distribution Current IF [mA] Forward Relative Intensity [%] Ambient Temperature Ta [℃] Wavelength λ [nm]...