Part Number | MXP18-C |
Manufacturer | Microsemi |
Description | Monolithic Photodiode Array-Chip |
Features | • • • • Dielectrically Isolated Diodes Aluminum Wire bondable Backside Metallization - Gold Die Attach methods: Eutectic... |
Published | May 9, 2005 |
Datasheet | MXP18-C PDF File |