DatasheetsPDF.com

MXP18-C

Microsemi
Part Number MXP18-C
Manufacturer Microsemi
Description Monolithic Photodiode Array-Chip
Features • • • • Dielectrically Isolated Diodes Aluminum Wire bondable Backside Metallization - Gold Die Attach methods: Eutectic...
Published May 9, 2005
Datasheet PDF File MXP18-C PDF File


MXP18-C
MXP18-C


Features




• Dielectrically Isolated Diodes Aluminum Wire bondable Backside Metallization - Gold Die Attach methods: Eutectic or Epoxy Electrical Characteristics @ 25oC SYMBOL VOC ISC VB CHARACTERISTIC Open Circuit Voltage Short Circuit Current Reverse B...



Similar Datasheet


INDEX :57ABCDEFGHIJKLMNOPQRSTUVWXYZ

Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)