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MX0912B351Y Dataheets PDF



Part Number MX0912B351Y
Manufacturers Philips
Logo Philips
Description NPN microwave power transistors
Datasheet MX0912B351Y DatasheetMX0912B351Y Datasheet (PDF)

DISCRETE SEMICONDUCTORS DATA SHEET MX0912B351Y NPN microwave power transistor Product specification Supersedes data of November 1994 1997 Feb 19 Philips Semiconductors Product specification NPN microwave power transistor FEATURES • Interdigitated structure; high emitter efficiency • Diffused emitter ballasting resistors providing excellent current sharing and withstanding a high VSWR • Gold metallization realizes very stable characteristics and excellent lifetime • Multicell geometry gives go.

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DISCRETE SEMICONDUCTORS DATA SHEET MX0912B351Y NPN microwave power transistor Product specification Supersedes data of November 1994 1997 Feb 19 Philips Semiconductors Product specification NPN microwave power transistor FEATURES • Interdigitated structure; high emitter efficiency • Diffused emitter ballasting resistors providing excellent current sharing and withstanding a high VSWR • Gold metallization realizes very stable characteristics and excellent lifetime • Multicell geometry gives good balance of dissipated power and low thermal resistance • Input and output matching cell allows an easier design of circuits. APPLICATIONS Intended for use in common base class C broadband pulse power amplifier from 960 to 1215 MHz for TACAN application. DESCRIPTION NPN silicon planar epitaxial microwave power transistor in a SOT439A metal ceramic flange package, with base connected to flange. It is mounted in common base configuration and specified in class C. 3 2 Top view olumns MX0912B351Y PINNING - SOT439A PIN 1 2 3 collector emitter base connected to flange DESCRIPTION 1 c b 3 e MAM045 Fig.1 Simplified outline and symbol. QUICK REFERENCE DATA Microwave performance up to Tmb = 25 °C in a common base class C broadband amplifier. MODE OF OPERATION Class C tp = 10 µs; δ = 10% f (GHz) 0.960 to 1.215 VCC (V) 50 PL (W) >325 Gpo (dB) >7 ηC (%) >40 Zi/ZL (Ω) see Figs 7 and 8 WARNING Product and environmental safety - toxic materials This product contains beryllium oxide. The product is entirely safe provided that the BeO slab is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste. 1997 Feb 19 2 Philips Semiconductors Product specification NPN microwave power transistor LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCBO VCES VCEO VEBO IC Ptot Tstg Tj Tsld Note 1. Up to 0.2 mm from ceramic. PARAMETER collector-base voltage collector-emitter voltage collector-emitter voltage emitter-base voltage collector current total power dissipation (peak power) storage temperature operating junction temperature soldering temperature t ≤ 10 s; note 1 open emitter RBE = 0 Ω open base open collector tp ≤ 10 µs; δ ≤ 10% Tmb = 75 °C; tp ≤ 10 µs; δ ≤ 10% CONDITIONS MX0912B351Y MIN. − − − − − − −65 − − MAX. 65 60 20 3 21 960 +200 200 235 UNIT V V V V A W °C °C °C handbook, halfpage 1000 Ptot (W) 800 MGL054 600 400 200 0 −50 0 100 Tmb (°C) 200 tp = 10 µs; δ = 10%; Ptot max = 960 W. Fig.2 Maximum power dissipation derating as a function of mounting base temperature. 1997 Feb 19 3 Philips Semiconductors Product specification NPN microwave power transistor THERMAL CHARACTERISTICS Tj = 125 °C unless otherwise specified. SYMBOL Rth j-mb Rth mb-h Zth j-h Notes 1. See “Mounting recommendations in the General part of handbook SC19a”. 2. Equivalent thermal impedance under nominal pulse microwave operating conditions. CHARACTERISTICS Tmb = 25 °C unless otherwise specified. SYMBOL ICBO ICES IEBO PARAMETER collector cut-off current collector cut-off current emitter cut-off current CONDITIONS VCB = 65 V; IE = 0 VCB = 50 V; IE = 0 VCE = 60 V; RBE = 0 Ω VEB = 1.5 V; IC = 0 PARAMETER thermal resistance from junction to mounting base CW thermal resistance from mounting base to heatsink CW; note 1 thermal impedance from junction to heatsink tp = 10 µs; δ = 10% notes 1 and 2 CONDITIONS MX0912B351Y MAX. 1.7 0.2 0.13 UNIT K/W K/W K/W MAX. 140 14 140 1.4 mA mA mA mA UNIT APPLICATION INFORMATION Microwave performance up to Tmb = 25 °C measured in the test circuit as shown in Fig.6 and working in class C broadband in pulse mode; note 1. MODE OF OPERATION Class C; tp = 10 µs; δ = 10% tp = 300 µs; δ = 10%; see Fig.5 Notes 1. Operating conditions and performance for other pulse formats can be made available on request. 2. VCC during pulse. f (GHz) 0.960 to 1.215 1.03 to 1.09 VCC (V)(2) 50 50 PL (W) >325 typ. 375 typ. 350 Gpo (dB) >7 typ. 7.6 typ. 8 ηC (%) >40 typ. 47 typ. 48 Zi/ZL (Ω) see Figs 7 and 8 1997 Feb 19 4 Philips Semiconductors Product specification NPN microwave power transistor MX0912B351Y handbook, halfpage 450 MGL056 handbook, halfpage 50 MGL055 PL (W) ηC (%) 400 45 350 0.95 1.05 1.15 f (GHz) 1.25 40 0.95 1.05 1.15 f (GHz) 1.25 VCC = 50 V; tp = 10 µs; δ = 10%. Fig.4 Fig.3 Load power as a function of frequency. (In broadband test circuit as shown in Fig.6) Collector efficiency as a function of frequency. (In broadband test circuit as shown in Fig.6) 1997 Feb 19 5 Philips Semiconductors Product specification NPN microwave power transistor MX0912B351Y handbook, full pagewidth 1 µs 1 µs 300 µs 3 ms MGK066 Fig.5 Pulse definition. List of components COMPONENT L1 L2 C1 C2 C3 C4 C5, C6.


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