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MAX6625 Dataheets PDF



Part Number MAX6625
Manufacturers Maxim
Logo Maxim
Description 9-Bit/12-Bit Temperature Sensors
Datasheet MAX6625 DatasheetMAX6625 Datasheet (PDF)

MAX6625/MAX6626 9-Bit/12-Bit Temperature Sensors with I2C-Compatible Serial Interface in a SOT23 General Description The MAX6625/MAX6626 combine a temperature sensor, a programmable overtemperature alarm, and an I2C-compatible serial interface into single compact packages. They convert their die temperatures into digital values using internal analogto-digital converters (ADCs). The result of the conversion is held in a temperature register, readable at any time through the serial interface. A .

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MAX6625/MAX6626 9-Bit/12-Bit Temperature Sensors with I2C-Compatible Serial Interface in a SOT23 General Description The MAX6625/MAX6626 combine a temperature sensor, a programmable overtemperature alarm, and an I2C-compatible serial interface into single compact packages. They convert their die temperatures into digital values using internal analogto-digital converters (ADCs). The result of the conversion is held in a temperature register, readable at any time through the serial interface. A dedicated alarm output, OT, activates if the conversion result exceeds the value programmed in the high-temperature register. A programmable fault queue sets the number of faults that must occur before the alarm activates, preventing spurious alarms in noisy environments. OT has programmable output polarity and operating modes. The MAX6625/MAX6626 feature a shutdown mode that saves power by turning off everything but the power-on reset and the I2C-compatible interface. Four separate addresses can be configured with the ADD pin, allowing up to four MAX6625/MAX6626 devices to be placed on the same bus. The MAX6625P/MAX6626P OT outputs are open drain, and the MAX6625R/MAX6626R OT outputs include internal pullup resistors. The MAX6625 has a 9-bit internal ADC and can function as a replacement for the LM75 in most applications. The MAX6626 has a 12-bit internal ADC. Both devices come in the space-saving 6-pin SOT23 package, or the 6-pin TDFN package. Applications ●● Fan Control ●● Temperature Alarms ●● System Temperature Control ●● Industrial Equipment Pin Configuration TOP VIEW + SDA 1 6 VS MAX6625 GND 2 MAX6626 5 ADD SCL 3 4 OT **EP = EXPOSED PAD SOT236 TDFN-EP** Features ●● 9-Bit Temperature-to-Digital Converter (MAX6625) ●● 12-Bit Temperature-to-Digital Converter (MAX6626) ●● I2C-Compatible Serial Interface ●● Up to Four Devices on a Single Bus ●● Versatile Alarm Output with Programmable Trip Temperature and Hysteresis ●● Low-Power Shutdown Mode ●● Space-Saving TDFN or SOT23 Packages ●● Lead-Free Version Available (TDFN Package) Ordering Information PART TEMP RANGE PIN-PACKAGE MAX6625PMUT* -55°C to +125°C 6 SOT23 MAX6625PMUT+* -55°C to +125°C 6 SOT23 MAX6625RMUT* -55°C to +125°C 6 SOT23 MAX6625RMUT+* -55°C to +125°C 6 SOT23 MAX6625PMTT* -55°C to +125°C 6 TDFN-EP** MAX6625RMTT* -55°C to +125°C 6 TDFN-EP** MAX6626PMUT* -55°C to +125°C 6 SOT23 MAX6626PMUT+* -55°C to +125°C 6 SOT23 MAX6626RMUT+* -55°C to +125°C 6 SOT23 MAX6626RMUT* -55°C to +125°C 6 SOT23 *For device options, see Selector Guide at end of data sheet. Requires special solder temperature profile described in the Absolute Maximum Ratings section. **EP = Exposed pad. # Indicates an RoHS-compliant part +Denotes a lead(Pb)-free/RoHS-compliant package. Ordering Information is continued at end of data sheet. Typical Operating Circuit 0.1µF VS 1kΩ 1kΩ 6 MAX6625 MAX6626 4 1 3 52 10kΩ (OMIT FOR MAX6625R AND MAX6626R) OT OUTPUT SDA TO I2C SCL MASTER 19-1841; Rev 8; 5/19 MAX6625/MAX6626 9-Bit/12-Bit Temperature Sensors with I2C-Compatible Serial Interface in a SOT23 Absolute Maximum Ratings VS to GND................................................................-0.3V to +6V OT, SCL, SDA to GND.............................................-0.3V to +6V ADD to GND.................................................-0.3V to (VS + 0.3V) Current into Any Pin............................................................±5mA OT Sink Current..................................................................20mA Continuous Power Dissipation 6-Pin SOT23 (derate 9.1mW/°C above +70°C)...........727mW 6-Pin TDFN (derate 23.8mW/°C above +70°C).........1905mW Junction Temperature.......................................................+150°C Storage Temperature Range............................. -60°C to +150°C ESD Rating (Human Body Model).....................................2000V Lead Temperature............................................................. Note 1 Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, IPC/JEDEC J-STD-020A, paragraph 7.6, Table 3 for IR/VPR and Convection Reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Electrical Characteristics (+3V ≤ VS ≤ +5.5V, TA = -55°C to +.


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