Document
GaAs DPDT Switch DC - 2 GHz
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MASW2040
V 2.00
Cascadable Low Insertion Loss Low DC Power Consumption Low Distortion Operation (Quiet Mode) Useful as a Building Block for – Digital – Digital – Digital – Digital Attenuators Delay Lines Phase Shifters Switched Filter Elements
Typical Performance @ +25°C
Guaranteed Specifications** -55°C to +85°C
Frequency Range Insertion Loss DC – 0.5 GHz DC – 1.0 GHz DC – 2.0 GHz DC – 0.5 GHz DC – 1.0 GHz DC – 2.0 GHz DC – 0.5 GHz DC – 1.0 GHz DC – 2.0 GHz DC – 2.0 GHz 0.4 dB Max 0.4 dB Max 0.6 dB Max 1.1:1 Max 1.2:1 Max 1.2:1 Max 25 dB Min 20 dB Min 15 dB Min
VSWR
Isolation
Operating Characteristics
Impedance Switching Characteristics tRISE, tFALL (10/90% or 90/10% RF) tON, tOFF (50% CTL to 90/10% RF) Transients (In-Band) Input Power for 1dB Compression Control Voltages (Vdc) 0/–5 0.05 GHz +24 dBm 0.5 - 2 GHz +30 dBm Intermodulation Intercept Point (for two-tone input power up to +5 dBm) Intercept Points IP2 0.05 GHz +62 0.5 - 2 GHz +68 dBm 50 Ω Nominal 3 ns Typ 6 ns Typ 20 mV Typ 0/–8 +25 dBm Typ +33 dBm Typ
IP3 +39 dBm Typ +46 dBm Typ
Control Voltages (Complementary Logic) VINLow 0 to –0.2V @ 9 µA Max VINHi –5V @ 25 µA Typ to –8V @ 75 µA Max Die Size 0.045" x 0.038 " x 0.010 " (1.13mm x 0.97mm x 0.25mm)
**All specifications apply with 50 Ω impedance connected to all RF ports, 0 and –5 Vdc control voltages. *** Loss change 0.0025dB/°C (-55°C to +85°C)
Schematic
Handling, Mounting, Bonding Procedure
MASW2040
V 2.00
Handling Precautions
Permanent damage to the MASW2040 may occur if the following precautions are not adhered to: A. Cleanliness — The MASW2040 should be handled in a clean environment. DO NOT attempt to clean unit after the MASW2040 is installed. B. Static Sensitivity — All chip handling equipment and personnel should be DC grounded. C. Transient — Avoid instrument and power supply transients while bias is applied to the MASW2040.Use shielded signal and bias cables to minimize inductive pick-up. D. Bias — Apply voltage to either control port A or B only when the other is grounded. Neither port should be allowed to “float”. E. General Handling — It is recommended that the MASW2040 chip be handled along the long side of the die with a sharp pair of bent tweezers. DO NOT touch the surface of the chip with fingers or tweezers.
Truth Table
Control Inputs
A V INHI VINL OW B VINLOW V INHI RF1 - RFA1 OFF ON
Condition of Switch
RF1 - RFB1 ON OFF RF2 - RFA2 OFF ON RF2 - RFB2 ON OFF
VINLOW = 0.0 TO -0.2V V INHI = -0.5V
Maximum Ratings A. Control Value (A or B): B. Max Input RF Power: C. Storage Temperature: D. Max Operating Temperature: –8.5 Vdc +34 dBm (500 MHz– 4 GHz) –65°C to +175°C +175°C
Mounting
The MASW2040 is back-metallized with Pd/Ni/Au(100/1,000/ 10,000Å) metallization. It can be die-mounted with AuSn eutectic preforms or with thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. A 80/20 gold/tin preform is recommend.