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MC10H106 Dataheets PDF



Part Number MC10H106
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Triple 4-3-3-Onput NOR Gate
Datasheet MC10H106 DatasheetMC10H106 Datasheet (PDF)

MC10H106 Triple 4-3-3-Input NOR Gate The MC10H106 is a triple 4–3–3 input NOR gate. This 10H part is a functional/pinout duplication of the standard MECL 10K family part, with 100% improvement in propagation delay and no increase in power– supply current. • Propagation Delay, 1.0 ns Typical • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible LOGIC DIAGRAM 4 5 6 7 9 10 11 12 13 14 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 http://.

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MC10H106 Triple 4-3-3-Input NOR Gate The MC10H106 is a triple 4–3–3 input NOR gate. This 10H part is a functional/pinout duplication of the standard MECL 10K family part, with 100% improvement in propagation delay and no increase in power– supply current. • Propagation Delay, 1.0 ns Typical • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible LOGIC DIAGRAM 4 5 6 7 9 10 11 12 13 14 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 http://onsemi.com MARKING DIAGRAMS 16 CDIP–16 L SUFFIX CASE 620A 1 16 MC10H106L AWLYYWW 3 PDIP–16 P SUFFIX CASE 648 1 MC10H106P AWLYYWW 2 PLCC–20 FN SUFFIX CASE 775 1 10H106 AWLYYWW 15 A WL YY WW = Assembly Location = Wafer Lot = Year = Work Week DIP PIN ASSIGNMENT VCC1 BOUT AOUT AIN AIN AIN AIN VEE 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC2 COUT CIN CIN CIN BIN BIN BIN ORDERING INFORMATION Device MC10H106L MC10H106P MC10H106FN Package CDIP–16 PDIP–16 PLCC–20 Shipping 25 Units/Rail 25 Units/Rail 46 Units/Rail Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D). © Semiconductor Components Industries, LLC, 2000 1 May, 2000 – Rev. 8 Publication Order Number: MC10H106/D MC10H106 MAXIMUM RATINGS Symbol VEE VI Iout TA Tstg Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current – Continuous – Surge Operating Temperature Range Storage Temperature Range – Plastic – Ceramic Characteristic Rating –8.0 to 0 0 to VEE 50 100 0 to +75 –55 to +150 –55 to +165 Unit Vdc Vdc mA °C °C °C ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note 1.) 0° Symbol IE IinH IinL VOH VOL VIH VIL tpd tr Characteristic Power Supply Current Input Current High Input Current Low High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage Min – – 0.5 –1.02 –1.95 –1.17 –1.95 Max 23 500 – –0.84 –1.63 –0.84 –1.48 Min – – 0.5 –0.98 –1.95 –1.13 –1.95 25° Max 21 310 – –0.81 –1.63 –0.81 –1.48 Min – – 0.3 –0.92 –1.95 –1.07 –1.95 75° Max 23 310 – –0.735 –1.60 –0.735 –1.45 Unit mA µA µA Vdc Vdc Vdc Vdc AC PARAMETERS Propagation Delay Rise Time 0.5 0.5 1.3 1.7 0.5 0.5 1.5 1.8 0.55 0.55 1.55 1.9 ns ns tf Fall Time 0.5 1.7 0.5 1.8 0.55 1.9 ns 1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. http://onsemi.com 2 MC10H106 PACKAGE DIMENSIONS PLCC–20 FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C B –N– Y BRK D –L– –M– W D X V A Z R 0.007 (0.180) M T L–M S 0.007 (0.180) M T L–M U S N S S 0.007 (0.180) M T L–M N S Z 20 1 G1 0.010 (0.250) S T L–M S N S VIEW D–D 0.007 (0.180) M T L–M S N N S H 0.007 (0.180) M T L–M S N S S K1 K C E 0.004 (0.100) G G1 0.010 (0.250) S T L–M J –T– SEATING PLANE F VIEW S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). 0.007 (0.180) M T L–M S N S VIEW S S N S DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– http://onsemi.com 3 MC10H106 B A 16 9 A B 1 8 CDIP–16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A–01 ISSUE O E F NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620–10. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.


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