MBRA130LT3

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MBRA130LT3/D Advance Information Surface Mount Schottky Power Rectifier SMA Power Surface Mount Package . . . employing the Schottky Barrier principle in a metal–to–silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. Compact Package with J–Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Over–Voltage Protection Low Forward Voltage Drop Mechanical Characteristics: Case: Molded Epoxy Epoxy Meets UL94, VO at 1/8″ Weight: 70 mg (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Polarity: Notch in Plastic Body Indicates Cathode Lead Available in 12 mm Tape, 5000 Units per 13 inch Reel, Add “T3” Suffix to Part Number Marking: B3 MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 105°C) Peak Repetitive Forward Current (At Rated VR, Square Wave, 100 kHz, TC = 105°C) Non-Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) Storage/Operating Case Temperature Operating Junction Temper...