Document
TD62786,787AP/F/AF
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62786AP,TD62786F,TD62786AF TD62787AP,TD62787F,TD62787AF
8CH HIGH−VOLTAGE SOURCE DRIVER
The TD62786AP / F / AF series are eight channel huyx non−inverting source current transistor array. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer and lamp drivers.
FEATURES
l High output voltage type−AP, AF : VCE (SUS) = 50 V (Min)
type−F
: VCE (SUS) = 35 V (Min)
l Output current (single output)
: IOUT = −500 mA / ch (Max)
l Output clamp diodes
l Single supply voltage
l Input compatible with TTL, 5 V CMOS
l Low level active input
l Package type−AP : DIP−18 pin
l Package type−F, AF : SOP−18 pin
PIN CONNECTION (TOP VIEW)
Weight DIP18−P−300−2.54D : 1.47 g (Typ.) SOP18−P−375−1.27 : 0.41 g (Typ.)
SCHEMATICS (EACH DRIVER)
Note: The input and output parasitic diodes cannot be used as clamp diodes.
1 2001-07-05
MAXIMUM RATINGS (Ta = 25°C)
TD62786,787AP/F/AF
CHARACTERISTIC
SYMBOL
RATING
UNIT
Supply Voltage
AP / AF F
Output Sustaining Voltage
AP / AF F
Output Current
Input Voltage
Input Voltage
Clamp Diode Forward Current
AP / AF F
Clamp Diode Forward Current
Power Dissipation
AP F / AF
Operating Temperature
Storage Temperature
VCC−VGND
VOUT IOUT VIN (Note 1) VIN (Note 2) VR
IF PD (Note 3)
Topr Tstg
50 35 −50 −35 −500 −30~0.5 VGND~7 50 35 500 1.47 0.96 −40~85 −55~150
V
V mA / ch
V V V mA W °C °C
Note 1: Only TD62786AP / F / AF Note 2: Only TD62787AP / F / AF Note 3: Delated above 25°C in the proportion of 11.7 mW / °C (AP Type), 7.7 mW / °C (F, AF Type).
RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C, VCC = 0 V)
CHARACTERISTIC
Supply Voltage Output Voltage
AP / AF F
AP / AF F
Output Current
Input Voltage
TD62786 TD62787
Clamp Diode Reverse Voltage
AP / AF F
Clamp Diode Forward Current
Power Dissipation
AP AF / F
SYMBOL VCC−VGND
VOUT IOUT VIN
VR IF PD
CONDITION
― ― ― ―
―
― ― ― ― ― ― ―
MIN TYP. MAX UNIT
― ― 50 V
― ― 35
― ― −50 V
― ― −35
―
―
−350
mA / ch
−30 ―
0
V
VGND ―
7
― ― 50 V
― ― 35
― ― 350 mA
― ― 0.52 W
― ― 0.35
2 2001-07-05
TD62786,787AP/F/AF
ELECTRICAL CHARACTERISTICS (Ta = 25°C, VCC = 0 V)
CHARACTERISTIC Output Leakage Current
SYMBOL ICEX
TEST CIR− CUIT
TEST CONDITION
1
VOUT = VGND = −50 V Ta = 85°C
MIN ―
Output Saturation Voltage
VCE (sat)
DC Current transfer Ratio
Input Voltage
“H” Level “L” Level
Input Current
TD62786 TD62787 TD62786 TD62787
Clamp Diode Reverse Current
hFE
VIN IIL IR
VIN = VIL MAX. 2 IOUT = −100 mA
VIN = VIL MAX. IOUT = −350 mA
2
VCC = 0 V, VCE = 3 V IOUT = −350 mA
4―
― VCC = 5.5 V, VIN = 0.4 V ― VR = VR MAX., Ta = 85°C
―
―
1000
−1.2 −1.6 −30 VGND ― ― ―
Clamp Diode Forward Voltage Turn−On Delay Turn Off Delay
VF tON tOFF
―― ―
5
VOUT = −50 V, RL = 163 Ω
CL = 15 pF
(Note)
― ―
TYP.
―
―
―
― ― ― ― ― ― ― ― ― 0.2 1.0
MAX
−100
−1.8
−2.0
― 0 5.5 −2.8 −3.7 −0.4
100
2.0 ― ―
UNIT µA
V
―
V
mA µA V µs
Note: VOUT = −35 V, RL = 116 Ω for Type−F
3 2001-07-05
TEST CIRCUIT 1. ICEX
3. IIN (ON), IIN (OFF)
5. tON, tOFF
TD62786,787AP/F/AF
2. VCE (sat), hFE
4. VIN (ON), VIN (OFF)
Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, tr ≤ 10 ns, tf ≤ 5 ns
Note 2: CL includes probe and jig capacitance.
PRECAUTIONS for USING
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
4 2001-07-05
TD62786,787AP/F/AF
5 2001-07-05
PACKAGE DIMENSIONS
DIP18−P−300−2.54D
TD62786,787AP/F/AF
Unit: mm
Weight: 1.47 g (Typ.)
6 2001-07-05
PACKAGE DIMENSIONS
SOP18−P−375−1.27
TD62786,787AP/F/AF
Unit: mm
Weight: 0.41 g (Typ.)
7 2001-07-05
TD62786,787AP/F/AF
RESTRICTIONS ON PRODUCT USE
000707EBA
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
· The TOS.