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TD62787F Dataheets PDF



Part Number TD62787F
Manufacturers Toshiba
Logo Toshiba
Description 8CH HIGH-VOLTAGE SOURCE DRIVER
Datasheet TD62787F DatasheetTD62787F Datasheet (PDF)

TD62786,787AP/F/AF TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62786AP,TD62786F,TD62786AF TD62787AP,TD62787F,TD62787AF 8CH HIGH−VOLTAGE SOURCE DRIVER The TD62786AP / F / AF series are eight channel huyx non−inverting source current transistor array. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer and lamp drivers. FEATURES l High output voltage type−AP, AF : VCE (SUS) = 50 V (Min) type−F : VCE (SUS) = 35 V (Min) .

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TD62786,787AP/F/AF TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62786AP,TD62786F,TD62786AF TD62787AP,TD62787F,TD62787AF 8CH HIGH−VOLTAGE SOURCE DRIVER The TD62786AP / F / AF series are eight channel huyx non−inverting source current transistor array. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer and lamp drivers. FEATURES l High output voltage type−AP, AF : VCE (SUS) = 50 V (Min) type−F : VCE (SUS) = 35 V (Min) l Output current (single output) : IOUT = −500 mA / ch (Max) l Output clamp diodes l Single supply voltage l Input compatible with TTL, 5 V CMOS l Low level active input l Package type−AP : DIP−18 pin l Package type−F, AF : SOP−18 pin PIN CONNECTION (TOP VIEW) Weight DIP18−P−300−2.54D : 1.47 g (Typ.) SOP18−P−375−1.27 : 0.41 g (Typ.) SCHEMATICS (EACH DRIVER) Note: The input and output parasitic diodes cannot be used as clamp diodes. 1 2001-07-05 MAXIMUM RATINGS (Ta = 25°C) TD62786,787AP/F/AF CHARACTERISTIC SYMBOL RATING UNIT Supply Voltage AP / AF F Output Sustaining Voltage AP / AF F Output Current Input Voltage Input Voltage Clamp Diode Forward Current AP / AF F Clamp Diode Forward Current Power Dissipation AP F / AF Operating Temperature Storage Temperature VCC−VGND VOUT IOUT VIN (Note 1) VIN (Note 2) VR IF PD (Note 3) Topr Tstg 50 35 −50 −35 −500 −30~0.5 VGND~7 50 35 500 1.47 0.96 −40~85 −55~150 V V mA / ch V V V mA W °C °C Note 1: Only TD62786AP / F / AF Note 2: Only TD62787AP / F / AF Note 3: Delated above 25°C in the proportion of 11.7 mW / °C (AP Type), 7.7 mW / °C (F, AF Type). RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C, VCC = 0 V) CHARACTERISTIC Supply Voltage Output Voltage AP / AF F AP / AF F Output Current Input Voltage TD62786 TD62787 Clamp Diode Reverse Voltage AP / AF F Clamp Diode Forward Current Power Dissipation AP AF / F SYMBOL VCC−VGND VOUT IOUT VIN VR IF PD CONDITION ― ― ― ― ― ― ― ― ― ― ― ― MIN TYP. MAX UNIT ― ― 50 V ― ― 35 ― ― −50 V ― ― −35 ― ― −350 mA / ch −30 ― 0 V VGND ― 7 ― ― 50 V ― ― 35 ― ― 350 mA ― ― 0.52 W ― ― 0.35 2 2001-07-05 TD62786,787AP/F/AF ELECTRICAL CHARACTERISTICS (Ta = 25°C, VCC = 0 V) CHARACTERISTIC Output Leakage Current SYMBOL ICEX TEST CIR− CUIT TEST CONDITION 1 VOUT = VGND = −50 V Ta = 85°C MIN ― Output Saturation Voltage VCE (sat) DC Current transfer Ratio Input Voltage “H” Level “L” Level Input Current TD62786 TD62787 TD62786 TD62787 Clamp Diode Reverse Current hFE VIN IIL IR VIN = VIL MAX. 2 IOUT = −100 mA VIN = VIL MAX. IOUT = −350 mA 2 VCC = 0 V, VCE = 3 V IOUT = −350 mA 4― ― VCC = 5.5 V, VIN = 0.4 V ― VR = VR MAX., Ta = 85°C ― ― 1000 −1.2 −1.6 −30 VGND ― ― ― Clamp Diode Forward Voltage Turn−On Delay Turn Off Delay VF tON tOFF ―― ― 5 VOUT = −50 V, RL = 163 Ω CL = 15 pF (Note) ― ― TYP. ― ― ― ― ― ― ― ― ― ― ― ― 0.2 1.0 MAX −100 −1.8 −2.0 ― 0 5.5 −2.8 −3.7 −0.4 100 2.0 ― ― UNIT µA V ― V mA µA V µs Note: VOUT = −35 V, RL = 116 Ω for Type−F 3 2001-07-05 TEST CIRCUIT 1. ICEX 3. IIN (ON), IIN (OFF) 5. tON, tOFF TD62786,787AP/F/AF 2. VCE (sat), hFE 4. VIN (ON), VIN (OFF) Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, tr ≤ 10 ns, tf ≤ 5 ns Note 2: CL includes probe and jig capacitance. PRECAUTIONS for USING This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. 4 2001-07-05 TD62786,787AP/F/AF 5 2001-07-05 PACKAGE DIMENSIONS DIP18−P−300−2.54D TD62786,787AP/F/AF Unit: mm Weight: 1.47 g (Typ.) 6 2001-07-05 PACKAGE DIMENSIONS SOP18−P−375−1.27 TD62786,787AP/F/AF Unit: mm Weight: 0.41 g (Typ.) 7 2001-07-05 TD62786,787AP/F/AF RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOS.


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