Chip LED Lamp
Semiconductor
Features
• 1.6mm(L)×0.8mm small size surface mount type • Thin package of 0.55mm(H) thickness • Transparen...
Description
Semiconductor
Features
1.6mm(L)×0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip led
Applications
LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp
Outline Dimensions
SM1316-D
Chip LED Lamp
unit : mm
KLM-4000-000
1
SM1316-D
Absolute maximum ratings
Characteristic
Symbol
Ratings
Power Dissipation
PD
70
Forward Current *1Peak Forward Current
IF IFP
25 50
Reverse Voltage
VR
4
Operating Temperature
Topr
-25∼80
Storage Temperature
Tstg
-30∼100
*2Soldering Temperature
Tsol
240℃ for 5 seconds
*1.Duty ratio = 1/16, Pulse width = 0.1ms
*2.Recommended soldering Temperature Profile (Reflow Soldering)
Temp(℃)
240℃
Peak Temp max
Peak time max 10sec
1~ 4℃/sec
140~ 160℃
Preheating area
120
Solder area max. 50sec
220℃
-2~ -6℃/sec
1~4℃/sec
Unit
mW mA mA V ℃ ℃
Time(sec)
Electrical Character...
Similar Datasheet