Document
Fiber Optics
XFP 1310 nm Small Form Factor Module 10 Gigabit Pluggable Transceiver Compatible with XFP MSA Rev. 3.1
Preliminary Data Sheet Features Standards • • • • • Compatible with IEEE 802.3ae™-2002 Compatible with Fibre Channel 10GFC Draft 3.5 Compatible with ITU-T G.693 11/2001 Compatible with XFP MSA Rev. 3.1 Compatible with Telcordia GR-253-CORE
V23833-Fx105-B001 V23833-Fx105-B002
File: 2115
Optical • • • • • • • • • IEEE Ethernet: Serial 1310 nm 10GBASE-LR T11 Fibre Channel: Serial 1310 nm 1200-SM-LL-L ITU-T G.693: VSR2000-2R1 Telcordia: SR1 Transmission distance 2 m up to 10 km Uncooled directly modulated Distributed Feedback (DFB) laser at 1310 nm According to XFP MSA Rev. 3.1 LC connector, single mode fiber Full duplex transmission mode
Ordering Information Part Number V23833-F0105-B001 V23833-F9105-B001 V23833-F0105-B002 V23833-F9105-B002 Chassis/Signal Grounding Concept Standard Separated Separated Common Common
1
Ethernet/Fibre Channel Multi-Protocol Ethernet/Fibre Channel Multi-Protocol
2004-06-04
Preliminary Product Information
V23833-Fx105-B001 V23833-Fx105-B002
Applications Monitoring and Control • • • • • • • • • • • • • Laser safety shut off Supply voltage 5 V / 3.3 V / 1.8 V Transmit power Received power RSSI Module temperature Laser bias current Tx_DIS Mod_NR Mod_DeSel Interrupt Mod_ABS P_Down/RST Rx_Los
Mechanical • Color coded blue for 1310 nm • Belly-to-belly applications • Latching mechanism with low insertion force Electrical • • • • • • • Hot pluggable Power supply 5 V / 3.3 V / 1.8 V Total power consumption: < 3.5 W max. XFI electrical interface External reference clock (transmit data synchronization B/64) Management and control via 2-wire interface 30 pin connector, 0.8 mm pitch
Applications • • • • • • • • 10GBE, 10GFC, OC-192/STM-64 and G.709 transmission systems for short range Integration on PCI card, with eventually mid-board mounting Belly-to-belly for high density applications Enterprise and campus network applications Storage applications Backplane and switch applications Aggregation point for lower date rate XFP evaluation kit V23833-F9909-Z001 available upon request
Preliminary Product Information
2
2004-06-04
V23833-Fx105-B001 V23833-Fx105-B002
Pin Configuration Pin Configuration
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
GND VEE5 MOD_DESEL INTERRUPT TX_DIS VCC5 GND VCC3 VCC3 SCL SDA MOD_ABS MOD_NR RX_LOS GND
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
GND TD+ TD− GND GND REFCLK− REFCLK+ GND VCC2 P_DOWN/RST VCC2 GND RD+ RD− GND
Bottom of Board (As viewed through top of board)
Top of Board
File: 2304
Figure 1
XFP Transceiver Electrical Pad Layout
Preliminary Product Information
3
2004-06-04
V23833-Fx105-B001 V23833-Fx105-B002
Pin Configuration Connector Pin Assignments Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Signal Name GND Pin No. 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 Signal Name GND TD+ TD– GND GND REFCLK– REFCLK+ GND
VEE5
MOD_DESEL INTERRUPT TX_DIS
VCC5
GND
VCC3 VCC3
SC.