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SI1304DL Dataheets PDF



Part Number SI1304DL
Manufacturers Vishay Siliconix
Logo Vishay Siliconix
Description N-Channel MOSFET
Datasheet SI1304DL DatasheetSI1304DL Datasheet (PDF)

Si1304DL Vishay Siliconix N-Channel 25-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 25 rDS(on) (W) 0.350 @ VGS = 4.5 V 0.450 @ VGS = 2.5 V ID (A) 0.75 0.66 Qg (Typ) 13 1.3 SOT-323 SC-70 (3-LEADS) G 1 Marking Code YY Lot Traceability and Date Code Part # Code Top View Ordering Information: Si1304DL-T1 3 D KB XX S 2 ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current Continuous.

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Si1304DL Vishay Siliconix N-Channel 25-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 25 rDS(on) (W) 0.350 @ VGS = 4.5 V 0.450 @ VGS = 2.5 V ID (A) 0.75 0.66 Qg (Typ) 13 1.3 SOT-323 SC-70 (3-LEADS) G 1 Marking Code YY Lot Traceability and Date Code Part # Code Top View Ordering Information: Si1304DL-T1 3 D KB XX S 2 ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current Continuous Diode Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C TA = 25_C TA = 70_C Symbol VDS VGS ID IDM IS PD TJ, Tstg 5 secs 25 Steady State Unit V "8 0.75 0.60 3.0 0.28 0.33 0.21 −55 to 150 0.24 0.29 0.19 0.70 0.56 A W _C THERMAL RESISTANCE RATINGS Parameter M i Maximum J Junction-to-Ambient ti t A bi ta Maximum Junction-to-Foot (Drain) Notes a. Surface Mounted on 1” x 1” FR4 Board. Document Number: 71315 S-41774—Rev. C, 04-Oct-04 www.vishay.com t v 5 sec Steady State Steady State Symbol RthJA RthJF Typical 315 380 285 Maximum 375 450 340 Unit _C/W 1 Si1304DL Vishay Siliconix SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED) Parameter Static Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain Source On-State Drain-Source On State Resistancea Forward Transconductancea Diode Forward Voltagea VGS(th) IGSS IDSS ID(on) rDS(on) DS( ) gfs VSD VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "8 V VDS = 25 V, VGS = 0 V VDS = 25 V, VGS = 0 V, TJ = 70_C VDS = 5 V, VGS = 4.5 V VGS = 4.5 V, ID = 0.75 A VGS = 2.5 V, ID = 0.50 A VDS = 15 V, ID = 0.75 A IS = 0.24 A, VGS = 0 V 3.0 0.280 0.355 1.5 0.8 1.2 0.350 0.450 0.6 1.3 "100 1 5 V nA mA A W S V Symbol Test Condition Min Typ Max Unit Dynamicb Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd td(on) tr td(off) tf trr IF = 0.24 A, di/dt = 100 A/ms VDD = 15 V, RL = 20 W ID ^ 0.75 A, VGEN = 4.5 V, Rg = 6 W VDS = 15 V, VGS = 4.5 V, ID = 0.75 A 1.3 0.31 0.5 11 18 17 11 30 20 30 30 20 60 ns 2.0 nC Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TYPICAL CHARACTERISTICS (25_C UNLESS NOTED) Output Characteristics 3.0 2.5 I D − Drain Current (A) 2.0 1.5 1.0 0.5 0.0 0 2 4 6 2V VGS = 5 thru 2.5 V 3.0 Transfer Characteristics TC = −55_C 2.5 I D − Drain Current (A) 2.0 1.5 1.0 0.5 0.0 0.0 25_C 125_C 1.5 V 1V 8 10 0.5 1.0 1.5 2.0 2.5 3.0 VDS − Drain-to-Source Voltage (V) www.vishay.com VGS − Gate-to-Source Voltage (V) Document Number: 71315 S-41774—Rev. C, 04-Oct-04 2 Si1304DL Vishay Siliconix TYPICAL CHARACTERISTICS (25_C UNLESS NOTED) On-Resistance vs. Drain Current 1.0 r DS(on) − On-Resistance ( W ) 200 Capacitance C − Capacitance (pF) 0.8 150 0.6 VGS = 2.5 V VGS = 4.5 V 0.2 100 0.4 Ciss Coss Crss 50 0.0 0.0 0 0.5 1.0 1.5 2.0 2.5 3.0 0 5 10 15 20 25 ID − Drain Current (A) VDS − Drain-to-Source Voltage (V) Gate Charge 8 V GS − Gate-to-Source Voltage (V) VDS = 15 V ID = 0.75 A rDS(on) − On-Resiistance (Normalized) 6 1.8 1.6 1.4 1.2 1.0 0.8 0 0.0 0.6 −50 On-Resistance vs. Junction Temperature VGS = 4.5 V ID = 0.75 A 4 2 0.5 1.0 1.5 2.0 2.5 −25 0 25 50 75 100 125 150 Qg − Total Gate Charge (nC) TJ − Junction Temperature (_C) Source-Drain Diode Forward Voltage 10 0.8 On-Resistance vs. Gate-to-Source Voltage I S − Source Current (A) 1 r DS(on) − On-Resistance ( W ) 0.6 ID = 0.75 A 0.4 0.1 TJ = 150_C 0.01 TJ = 25_C 0.2 0.001 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8 VSD − Source-to-Drain Voltage (V) VGS − Gate-to-Source Voltage (V) Document Number: 71315 S-41774—Rev. C, 04-Oct-04 www.vishay.com 3 Si1304DL Vishay Siliconix TYPICAL CHARACTERISTICS (25_C UNLESS NOTED) Threshold Voltage 0.2 0.1 V GS(th) Variance (V) ID = 250 mA −0.0 −0.1 −0.2 −0.3 −0.4 −50 4 Power (W) 12 TA = 25_C 8 20 Single Pulse Power, Junction-to-Ambient 16 −25 0 25 50 75 100 125 150 0 10−3 10−2 10−1 1 10 100 600 TJ − Temperature (_C) 2 1 Time (sec) Normalized Thermal Transient Impedance, Junction-to-Ambient Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10−4 10−3 10−2 10−1 1 Square Wave Pulse Duration (sec) Notes: PDM t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 360_C/W 3. TJM − TA = PDMZthJA(t) 4. Surface Mounted 10 100 600 2 1 Normalized Thermal Transient Impedance, Ju.


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