Board Level Power Semiconductor Heat Sinks
BOARD LEVEL HEAT SINKS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
216 SERIES
Standard P/N 216-40CT 216-40CTT 216-40CTR
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Description
BOARD LEVEL HEAT SINKS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
216 SERIES
Standard P/N 216-40CT 216-40CTT 216-40CTR
Surface Mount Heat Sinks
Height Above PC Board .390 in. (9.9) .390 in. (9.9) .390 in. (9.9) Footprint Dimensions .600 in. (15.2) x .740 in. (18.8) .600 in. (15.2) x .740 in. (18.8) .600 in. (15.2) x .740 in. (18.8) Package Format Bulk Tube Tape & Reel Package Quantity 1 25 250
D 2PAK, TO-220, SOL-20
Thermal Performance at Typical Load Natural Convection Forced Convection 55°C @ 1W 16.0°C/W @ 200 LFM 55°C @ 1W 16.0°C/W @ 200 LFM 55°C @ 1W 16.0°C/W @ 200 LFM
PATENT 361317
Increase the power dissipation level of D2PAK, TO-220, SOL-20 and other surface mount power components while maintaining the benefits of high-speed, automated pick and place assembly technology. The patented 216 Series heat sink is mounted astride the component and solder reflowed to the PCB using standard board assembly equipment (Fuji, Philips, etc.) and processes. This creates a very low thermal resistance path from the component tab to the heat sink and in turn to the ambient air which lowers junction temperatures for reliable operation. Available in bulk, tube or tape & reel packaging which meet EIA Standards and ESD protection requirements. Material: Copper, tin-lead plated.
216-40CTR A RECOMMENDED COPPER FOOTPRINT USE MAX COPPER TO ALLOW MAX CONDUCTION TO HEAT SINK .660 (16.8) .640 (16.3) .660 (16.8) .640 (16.3) COPPER FOOTPRINT FOR HEAT SINK MIN COPPER FOR HEAT SINK 1.260 (32.0) .3...
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