P-Channel 2.5V Specified PowerTrench
FDZ204P
March 2003
FDZ204P
P-Channel 2.5V Specified PowerTrench
BGA MOSFET
Features
• –4.5 A, –20 V. RDS(ON) = 45 m...
Description
FDZ204P
March 2003
FDZ204P
P-Channel 2.5V Specified PowerTrench
BGA MOSFET
Features
–4.5 A, –20 V. RDS(ON) = 45 mΩ @ VGS = –4.5 V RDS(ON) = 75 mΩ @ VGS = –2.5 V Occupies only 4 mm2 of PCB area. Less than 40% of the area of a SSOT-6 Ultra-thin package: less than 0.80 mm height when mounted to PCB Ultra-low Qg x RDS(ON) figure-of-merit. High power and current handling capability.
General Description
Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON).
Applications
Battery management Load switch Battery protection
D
D S S
D
P in 1
S
F204P
S G
S S
G
Bottom
Top
TA=25oC unless otherwise noted
D
Absolute Maximum Ratings
VDSS VGSS ID
Symbol
PD TJ, TSTG
Drain-Source Voltage Gate-Source Voltage Drain Current – Continuous (Note 1a) – Pulsed Power Dissipation (Steady State) (Note 1a) Operating and Storage Junction Temperature Range
Parameter
–20 ±12 –4.5 –20 1.8 –55 to +150
Ratings
Units
V V A
W °C
Thermal Characteristics
RθJA RθJB RθJC
Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Ball Thermal Resistance, Junction-to-Case
(Note 1a) (Note 1) (Note 1)
67 11 1
°C/W °C/W °C/W
Packag...
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