Document
Silicon Switching Diode • For high-speed switching applications • Pb-free (RoHS compliant) package1) • Qualified according AEC Q101
BAL74/BAR74...
BAL74
!
BAR74
!
Type BAL74 BAR74
Package SOT23 SOT23
Configuration single single
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter
Symbol
Diode reverse voltage Peak reverse voltage Forward current Peak forward current Surge forward current, t = 1 µs Non-repetitive peak surge forward current Total power dissipation TS ≤ 54°C Junction temperature Storage temperature
VR VRM IF IFM IFS IFSM Ptot
Tj Tstg
Thermal Resistance
Parameter
Symbol
Junction - soldering point2), BAL74, BAR74
RthJS
1Pb-containing package may be available upon special request 2For calculation of RthJA please refer to Application Note Thermal Resistance
Marking JCs JBs
Value 50 50 250 4.5 370
Unit V
mA
A mW
150 -65 ... 150
°C
Value ≤ 260
Unit K/W
1 2007-04-19
BAL74/BAR74...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
Symbol
Values
Unit
min. typ. max.
DC Characteristics
Breakdown voltage I(BR) = 100 µA
V(BR)
50 -
-V
Reverse current VR = 50 V VR = 50 V, TA = 150 °C
IR µA - - 0.1 - - 100
Forward voltage IF = 100 mA
VF - - 1 V
AC Characteristics
Diode capacitance VR = 0 V, f = 1 MHz
CT - - 2 pF
Reverse recovery time
IF = 10 mA, IR = 10 mA, measured at IR = 1mA, RL = 100 Ω
trr
- - 4 ns
Test circuit for reverse recovery time
D.U.T.
Ι F Oscillograph
EHN00015
Pulse generator: tp = 100ns, D = 0.05, tr = 0.6ns, Ri = 50Ω
Oscillograph: R = 50Ω, tr = 0.35ns, C ≤ 1pF
2 2007-04-19
BAL74/BAR74...
Reverse current IR = ƒ (TA) VR = Parameter
10 5 BAR 74 nA ΙR 10 4 5
10 3 5
10 2 5
EHB00012
VR = 70 V max.
70V 25V
typ.
Forward Voltage VF = ƒ (TA) IF = Parameter
1.0 BAR 74
V VF
Ι F = 100 mA 10 mA
1 mA 0.5
0.1 mA
EHB00015
10 1 0
0
50 100 ˚C 150
0
TA
50 100 ˚C 150 TA
Forward current IF = ƒ (VF)
Peak forward current IFM = ƒ (tp)
150 BAR 74 ΙF
mA 100
50
00
EHB00013
10 2 BAR 74 Ι FM A
10 1
typ max
10 0
EHB00014
D = 0.005 0.01 0.02 0.05 0.1 0.2
10 -1
tp
D
=
tp T
T
0.5
1.0 V 1.5
10-2 10-6 10-5 10-4 10-3 10-2 10-1 s 100
VF t
3 2007-04-19
Forward current IF = ƒ (TS) BAL74, BAR74
300 mA
IF
200
150
100
50
0 0
15 30 45 60 75 90 105 120 °C
150
TS
BAL74/BAR74...
4 2007-04-19
Package SOT23
BAL74/BAR74...
2.4 ±0.15 0.15 MIN.
10˚ MAX. 10˚ MAX.
1.3 ±0.1
Package Outline Foot Print
2.9 ±0.1
3
B
1±0.1 0.1 MAX.
1
0.4
+0.1 1) -0.05
1.9
2
C 0.95
0.25 M B C
0.08...0.15 A 0...8˚ 0.2 M A
1) Lead width can be 0.6 max. in dambar area
0.8
0.9 1.3 0.9
0.8 1.2
Marking Layout (Example)
EH s
Pin 1
Manufacturer
2005, June Date code (YM)
BCW66 Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel
4 0.9
0.2
2.13 2.65 8
Pin 1 3.15
5
1.15
2007-04-19
BAL74/BAR74...
Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved.
Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party.
Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
6 2007-04-19
.