High-speed diode
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D088
BAL74 High-speed diode
Product specification Supersedes data ...
Description
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D088
BAL74 High-speed diode
Product specification Supersedes data of 1996 Sep 03 1999 May 26
Philips Semiconductors
Product specification
High-speed diode
FEATURES Small plastic SMD package High switching speed: max. 4 ns Continuous reverse voltage: max. 50 V Repetitive peak reverse voltage: max. 50 V Repetitive peak forward current: max. 500 mA.
handbook, halfpage 2
BAL74
DESCRIPTION The BAL74 is a high-speed switching diode fabricated in planar technology, and encapsulated in the small SOT23 plastic SMD package. PINNING PIN 1 2 3 DESCRIPTION not connected anode cathode
1 1 n.c. 3 3
MAM230
APPLICATIONS High-speed switching in e.g. surface mounted circuits.
2
Marking code: JCp = made in Hong Kong; JCt = made in Malaysia.
Fig.1 Simplified outline (SOT23) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM VR IF IFRM IFSM PARAMETER repetitive peak reverse voltage continuous reverse voltage continuous forward current repetitive peak forward current non-repetitive peak forward current square wave; Tj = 25 °C prior to surge; see Fig.4 t = 1 µs t = 1 ms t=1s Ptot Tstg Tj Note 1. Device mounted on an FR4 printed-circuit board. total power dissipation storage temperature junction temperature Tamb = 25 °C; note 1 − − − − −65 − 4 1 0.5 250 +150 150 A A A mW °C °C see Fig.2; note 1 CONDITIONS − − − − MIN. MAX. 50 50 215 500 V V mA mA UNIT
1999 May 26
2
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