Fast-acting Chip surface mount fuse
Technical Data 3001
Effective October 2017 Supersedes May 2017
3216FF
Fast-acting Chip™ surface mount fuse
HALOGEN
HF...
Description
Technical Data 3001
Effective October 2017 Supersedes May 2017
3216FF
Fast-acting Chip™ surface mount fuse
HALOGEN
HF
FREE
Pb
Environmental data
Product features AEC-Q200 qualified (250 mA to 7 A) Fast-acting surface mount fuse Ratings up to 30 amps Excellent temperature and cycling characteristics Compatible with reflow and wave solder Agency information
UL Recognition Guide JDYX2 & File E19180. CSA Component Acceptance: 053787 C 000 &
Class No: 1422 30. cURus Recognition File: E19180, Guide JDYX2/
JDYX8
Soldering method
Wave Immersion: 260 °C, 10 sec max. Infrared Reflow: 260 °C, 30 sec max.
Thermal Shock: MIL-STD-202, Method 107, Test Condition B (-65 °C to +125 °C)
Vibration: MIL-STD-202, Method 204, Test Condition C (55 Hz - 2 kHz, 10 G)
Moisture Resistance: MIL-STD-202, Method 106,10 day cycle
Solderability: ANSI/J-STD-002, Test B Additional resistance to solder heat test: MIL-
STD-202G Method 210F Condit...
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