Fast Acting Chip Fuse
S0603F Series Fast Acting Chip Fuse
Description
■ Fast acting for excessive current ■ Compatible with reflow and wave s...
Description
S0603F Series Fast Acting Chip Fuse
Description
■ Fast acting for excessive current ■ Compatible with reflow and wave solder ■ Rugged ceramic and glass construction ■ Excellent environmental performance ■ RoHS Compliant, Lead Free & Halogen Free
material
Applications
■ Telecommunication: PDA / DSL/ Cell Phones ■ Computers: LCD Panels / Printers/ Laptops/
Servers ■ Consumer Electronics: DVD players/ MP3 and
MP4 Players
Sn PLATING CERAMIC SUBSTRATE
OVERCOAT
FUSE ELEMENT Ag / Ni PLATING
Case: 0603
Environmental Data
■ Life Test: MIL-STD-202, Method 108A ■ Humidity Bias: MIL-STD-202, Method 103 ■ Moisture Resistance Test: MIL-STD-202, Method 106G ■ Thermal Shock: MIL-STD-202, Method 107G ■ Terminal Strength: AEC-Q200-006 ■ Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min) ■ Vibration: MIL-STD-202, Method 204D ■ Mechanical Shock: MIL-STD-202, Method 213B ■ Solderability: MIL-STD-202 Method 208H ■ Resistance to Solder Heat: MIL-STD-202, Method 210A
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