S0603F500

S0603F Series Fast Acting Chip Fuse Description ■ Fast acting for excessive current ■ Compatible with reflow and wave solder ■ Rugged ceramic and glass construction ■ Excellent environmental performance ■ RoHS Compliant, Lead Free & Halogen Free material Applications ■ Telecommunication: PDA / DSL/ Cell Phones ■ Computers: LCD Panels / Printers/ Laptops/ Servers ■ Consumer Electronics: DVD players/ MP3 and MP4 Players Sn PLATING CERAMIC SUBSTRATE OVERCOAT FUSE ELEMENT Ag / Ni PLATING Case: 0603 Environmental Data ■ Life Test: MIL-STD-202, Method 108A ■ Humidity Bias: MIL-STD-202, Method 103 ■ Moisture Resistance Test: MIL-STD-202, Method 106G ■ Thermal Shock: MIL-STD-202, Method 107G ■ Terminal Strength: AEC-Q200-006 ■ Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min) ■ Vibration: MIL-STD-202, Method 204D ■ Mechanical Shock: MIL-STD-202, Method 213B ■ Solderability: MIL-STD-202 Method 208H ■ Resistance to Solder Heat: MIL-STD-202, Method 210A ...