THGBMHG7C1LBAIL

THGBMHG7C1LBAIL 16GB THGBMHG7C1LBAIL INTRODUCTION TOSHIBA e-MMC Module THGBMHG7C1LBAIL is 16GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMHG7C1LBAIL has an industry standard MMC protocol for easy use. FEATURES THGBMHG7C1LBAIL Interface THGBMHG7C1LBAIL has the JEDEC/MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC NC 10 NC NC NC VSF VSF RFU Vss Vcc RFU NC NC RFU 9 NC NC NC VSF Vcc NC NC NC 8 NC NC NC RFU Vss NC NC NC Top View 7 RFU NC NC Vss RFU NC NC RFU 6 Vss DAT7 VccQ Vcc RFU CLK NC VssQ 5 DAT2 DAT6 NC RFU Vcc Vss DS Vss RST_n CMD VssQ VccQ 4 DAT1 DAT5 VssQ NC index VccQ VccQ ...