SOT1061

HUSON3 SOT1061 DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm 8 February 2016 Package information 1. Package summary Terminal position code Package type descriptive code Package type industry code Package style descriptive code Package style suffix code Package body material type IEC package outline code JEDEC package outline code JEITA package outline code Mounting method type Issue date Table 1. Package summary Symbol Parameter D package length E package width A seated height n2 actual quantity of termination D (double) DFN2020-3 DFN2020-3 HUSON (thermal enhanced ultra thin small outline; no leads) NA (not applicable) P (plastic) ------S (surface mount) 7-10-2008 Min Typ Nom Max Unit 1.9 - 2 2.1 mm 1.9 - 2 2.1 mm [tbd] - 0.65 0.65 mm - - 3- NXP Semiconductors 2. Package outline SOT1061 DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x...