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TC1211LC Dataheets PDF



Part Number TC1211LC
Manufacturers CITC
Logo CITC
Description ESD Protection Device
Datasheet TC1211LC DatasheetTC1211LC Datasheet (PDF)

Chip Integration Technology Corporation TC1211LC ESD Protection Device ■Features • Uni-directional ESD protection. • Surface mount package. • Ultra small SMD package:0402. • High component density. ■ Mechanical data • Case : 0402/SOD-923F standard package,molded plastic. • Terminals : Gold plated, solderable per MIL-STD-750 Method 2026 • Μarking Code : Cathode band & E2 • Mounting position : Any. • Weight : 0.001 grams(Approx). ■Outline SOD-923F 0.041(1.05) 0.037(0.95) 0.026(0.65) 0.022(0.5.

  TC1211LC   TC1211LC


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Chip Integration Technology Corporation TC1211LC ESD Protection Device ■Features • Uni-directional ESD protection. • Surface mount package. • Ultra small SMD package:0402. • High component density. ■ Mechanical data • Case : 0402/SOD-923F standard package,molded plastic. • Terminals : Gold plated, solderable per MIL-STD-750 Method 2026 • Μarking Code : Cathode band & E2 • Mounting position : Any. • Weight : 0.001 grams(Approx). ■Outline SOD-923F 0.041(1.05) 0.037(0.95) 0.026(0.65) 0.022(0.55) 0.014(0.35) 0.010(0.25) 0.022(0.55) 0.018(0.45) ■ Circuit Diagram 0.020(0.50) 0.016(0.40) Dimensions in inches and (millimeters) ■Maximum ratings and electrical characteristics (at TA=25°C unless otherwise noted) Parameter Marking code Forward voltage Diode breakdown voltage Leakage current Junction capacitance ESD capability Clamping Voltage Peak pulse power Operating Junction temperature Storage temperature Conditions IF = 10mA IR = 1mA VR = 12V VR =0V,f.


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