THGBMDG5D1LBAIL

THGBMDG5D1LBAIL 4GB THGBMDG5D1LBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMDG5D1LBAIL is 4GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMDG5D1LBAIL has an industry standard MMC protocol for easy use. FEATURES THGBMDG5D1LBAIL Interface THGBMDG5D1LBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC NC 10 NC NC NC VSF VSF RFU Vss Vcc RFU NC NC RFU 9 NC NC NC VSF Vcc NC NC NC 8 NC NC NC RFU Vss NC NC NC Top View 7 RFU NC NC Vss RFU NC NC RFU 6 Vss DAT7 VccQ Vcc RFU CLK NC VssQ 5 DAT2 DAT6 NC RFU Vcc Vss DS Vss RST_n CMD VssQ VccQ 4 DAT1 DAT5 VssQ NC index VccQ VccQ Vss...