BZT52C9V1

HITANO ENTERPRISE CORP. BZT52C2V4 THRU BZT52C39 TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON ZENER DIODES FEATURES * Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals: Solder plated, solderable per MIL-STD-202, Method 208 * Polarity: See Diagram Below * Mounting position: Any * Weight: 0.008 gram Approx. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 oC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. Dimensions in inches(millimeters) Zener Current see Table "Characteristics" Power Dissipation (Notes 1) at Tamb=25oC Peak Forward Surge Current, 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) (Notes 2) Maximum Forward Voltage at IF=100mA Operating and Storage Temperature SYMBOL Ptot IFSM VF TJ,Tstg...