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2N3458-59-60
2N3458, 2N3459, 2N3460 N-Channel JFET
Features
• InterFET N0016H Geometry • InterFET N0032H Geometry (2N3458) • Low Noise: 5 nV/√Hz Typical • High Gain: 7.5mS Typical (2N3458) • Low Cutoff Voltage: 2N3460 < 1.8V • RoHS Compliant • SMT, TH, and Bare Die Package options.
Applications
• General Purpose Amplifiers
Description
The -50V InterFET 2N3458, 2N3459, and 2N3460 are targeted for sensitive amplifier stages for midfrequencies designs. Gate leakages are typically less than 10pA at room temperatures. The 2N3460 has a cutoff voltage of less than 1.8V ideal for low-level power supplies. The TO-18 package is hermetically sealed and suitable for military applications.
Gate/Case Drain 2 Source
TO-18 Bottom View
3
1
Source 1 Drain 2
SOT23 Top View 3 Gate
Gate 3 Drain 2 Source 1
TO-92 Bottom View
Product Summary
Parameters BVGSS Gate to Source Breakdown Voltage IDSS Drain to Source Saturation Current VGS(off) Gate to Source Cutoff Voltage GFS Forward Transconductance
2N3458 Min -50 3
-7.8 (Max) 2.5
2N3459 Min -50 0.8
-3.4 (Max) 1.5
Ordering Information Custom Part and Binning Options Available
Part Number
Description
2N3458; 2N3459; 2N3460
Through-Hole
PN3458; PN3459; PN3460
Through-Hole
SMP3458; SMP3459; SMP3460
Surface Mount
7“ Tape and Reel: Max 3,000 Pieces
SMP3458TR; SMP3459TR; SMP3460TR 13” Tape and Reel: Max 9,000 Pieces
Chip Orientated Tray
2N3458COT; 2N3459COT; 2N3460COT (COT Waffle Pack)
Chip Face-up Tray
2N3458CFT; 2N3459CFT; 2N3460CFT
(CFT Waffle Pack)
Case TO-18 TO-92 SOT23
SOT23
COT
CFT
2N3460 Min
Unit
-50
V
0.2
mA
-1.8 (Max)
V
0.8
mS
Packaging Bulk Bulk Bulk
Minimum 1,000 Pieces Tape and Reel
400/Waffle Pack
400/Waffle Pack
Disclaimer: It is the Buyers responsibility for designing, validating and testing the end application under all field use cases and extreme use conditions. Guaranteeing the application meets required standards, regulatory compliance, and all safety and security requirements is the responsibility of the Buyer. These resources are subject to change without notice.
IF35093.R00
InterFET
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2N3458-59-60
Electrical Characteristics
Maximum Ratings (@ TA = 25°C, Unless otherwise specified)
Parameters VRGS Reverse Gate Source and Gate Drain Voltage IFG Continuous Forward Gate Current PD Continuous Device Power Dissipation P Power Derating TJ Operating Junction Temperature TSTG Storage Temperature
Value -50 10 300 1.7
-55 to 125 -65 to 150
Unit V mA
mW mW/°C
°C °C
Static Characteristics (@ TA = 25°C, Unless otherwise specified)
V(BR)GSS IGSS VGS(OFF) IDSS
Parameters Gate to Source Breakdown Voltage Gate to Source Reverse Current Gate to Source Cutoff Voltage Drain to Source Saturation Current
Conditions VDS = 0V, IG = -1μA
VGS = -30V, VDS = 0V
VDS = 20V, ID = 1nA VDS = 20V, VGS = 0V
(Pulsed)
2N3458
2N3459
2N3460
Min Max Min Max Min Max Unit
-50
-50
-50
V
-1
-1
-1 nA
-7.8
-3.4
-1.8 V
3 15 0.8 4 0.2 1 mA
Dynamic Characteristics (@ TA = 25°C, Unless otherwise specified)
2N3458
2N3459
2N3460
Parameters
Conditions
Min Max Min Max Min Max Unit
GFS
Forward Transconductance
VDS = -20V, VGS = 0V, f = 1kHz 2.5 10 1.5 6 0.8 4.5 mS
Ciss
Input Capacitance
VDS = 0V, VGS = ( ), f = 1MHz
18
18
(10)
(8)
18 pF (4) V
Crss
Reverse Transfer Capacitance
VDS = 30V, ID = 5mA, f = 1MHz
5
5
5 pF
2N3458-9-60
Document Number: IF35093.R00
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SOT23 (TO-236AB) Mechanical and Layout Data
Package Outline Data
2N3458-59-60
Suggested Pad Layout
1. All linear dimensions are in millimeters. 2. Package weight approximately 0.12 grams 3. Molded plastic case UL 94V-0 rated 4. For Tape and Reel specifications refer to
InterFET CTC-021 Tape and Reel Specification, Document number: IF39002 5. Bulk product is shipped in standard ESD shipping material 6. Refer to JEDEC standards for additional information.
2N3458-9-60
Document Number: IF35093.R00
1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been
provided for reference only. A more robust pattern may be desired for wave soldering.
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TO-18 Mechanical and Layout Data
Package Outline Data
2N3458-59-60
Suggested Through-Hole Layout
1. All linear dimensions are in millimeters. 2. Package weight approximately 0.29 grams 3. Bulk product is shipped in standard ESD shipping
material 4. Refer to JEDEC standards for additional
information.
1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been
provided as a straight lead reference only. A more robust pattern may be desired for wave soldering and/or bent lead configurations.
2N3458-9-60
Document.