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H9TQ17ABJTMCUR

Hynix Semiconductor
Part Number H9TQ17ABJTMCUR
Manufacturer Hynix Semiconductor
Description 16GB eNAND (x8) / LPDDR3 16Gb(x32)
Published Sep 27, 2016
Detailed Description CI-MCP Specification 16GB eNAND (x8) + 16Gb LPDDR3 (x32) This document is a general product description and is subject ...
Datasheet PDF File H9TQ17ABJTMCUR PDF File

H9TQ17ABJTMCUR
H9TQ17ABJTMCUR

Overview
CI-MCP Specification 16GB eNAND (x8) + 16Gb LPDDR3 (x32) This document is a general product description and is subject to change without notice.
SK hynix does not assume any responsibility for use of circuits described.
No patent licenses are implied.
Rev 0.
1 / Mar.
2014 1 Preliminary H9TQ17ABJTMCUR series 16GB eNAND (x8) / LPDDR3 16Gb(x32) Document Title CI-MCP 16GB eNAND(x8) Flash / 16Gb (x32) LPDDR3 Revision History Revision No.
0.
1 - Initial Draft History Draft Date Mar.
2014 Remark Preliminary Rev 0.
1 / Mar.
2014 2 Preliminary H9TQ17ABJTMCUR series 16GB eNAND (x8) / LPDDR3 16Gb(x32) FEATURES [ CI-MCP ] ● Operation Temperature - (-25)oC ~ 85oC ● Package - 221-ball FBGA - 11.
...


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