Document
• 1N5518BUR-1 THRU 1N5546BUR-1 AVAILABLE IN JAN, JANTX AND JANTXV PER MIL-PRF-19500/437 • ZENER DIODE, 500mW • LEADLESS PACKAGE FOR SURFACE MOUNT • LOW REVERSE LEAKAGE CHARACTERISTICS • METALLURGICALLY BONDED
1N5518BUR-1 thru 1N5546BUR-1 and CDLL5518 thru CDLL5546D
MAXIMUM RATINGS
Junction and Storage Temperature: -65°C to +125°C DC Power Dissipation: 500 mW @ TEC = +125°C Power Derating: 10 mW / °C above TEC = +125°C Forward Voltage @ 200mA: 1.1 volts maximum ELECTRICAL CHARACTERISTICS @ 25°C, unless otherwise specified.
B-C-D SUFFIX MAXIMUM DC ZENER
CDI TYPE NUMBER
NOMINAL ZENER ZENER TEST VOLTAGE CURRENT VZ@ 1ZT (NOTE 2) VOLTS 1ZT
MAX. ZENER IMPEDANCE B-C-D SUFFIX ZZT @ 1ZT (NOTE 3) OHMS
MAXIMUM REVERSE LEAKAGE CURRENT
REGULATION FACTOR CURRENT ∆VZ (NOTE 5) VOLTS
LOW VZ CURRENT 1ZL
(NOTE 1)
lR (NOTE 4)
VR = VOLTS NON & ASUFFIX B-C-DSUFFIX
1ZM
mA
µ Adc
5.0 3.0 1.0 3.0 2.0 2.0 2.0 1.0 1.0 0.5 0.5 0.1 0.05 0.05 0.05 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01
mA
mA
CDLL5518B CDLL5519B CDLL5520B CDLL5521B CDLL5522B CDLL5523B CDLL5524B CDLL5525B CDLL5526B CDLL5527B CDLL5528B CDLL5529B CDLL5530B CDLL5531B CDLL5532B CDLL5533B CDLL5534B CDLL5535B CDLL5536B CDLL5537B CDLL5538B CDLL5539B CDLL5540B CDLL5541B CDLL5542B CDLL5543B CDLL5544B CDLL5545B CDLL5546B
3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 22.0 24.0 25.0 28.0 30.0 33.0
20 20 20 20 10 5.0 3.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0
26 24 22 18 22 26 30 30 30 35 40 45 60 80 90 90 100 100 100 100 100 100 100 100 100 100 100 100 100
0.90 0.90 0.90 1.0 1.5 2.0 3.0 4.5 5.5 6.0 6.5 7.0 8.0 9.0 9.5 10.5 11.5 12.5 13.0 14.0 15.0 16.0 17.0 18.0 20.0 21.0 23.0 24.0 28.0
1.0 1.0 1.0 1.5 2.0 2.5 3.5 5.0 6.2 6.8 7.5 8.2 9.1 9.9 10.8 11.7 12.6 13.5 14.4 15.3 16.2 17.1 18.0 19.8 21.6 22.4 25.2 27.0 29.7
115 105 98 88 81 75 68 61 56 51 46 42 38 35 32 29 27 25 24 22 21 20 19 17 16 15 14 13 12
0.90 0.90 0.85 0.75 0.60 0.65 0.30 0.20 0.10 0.05 0.05 0.05 0.10 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.25 0.30 0.35 0.40 0.45 0.50
2.0 2.0 2.0 2.0 1.0 0.25 0.25 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01
DIM D F G G1 S
MILLIMETERS INCHES MIN MAX MIN MAX 1.60 1.70 0.063 0.067 0.41 0.55 0.016 0.022 3.30 3.70 .130 .146 2.54 REF. .100 REF. 0.03 MIN. .001 MIN.
FIGURE 1
DESIGN DATA
CASE: DO-213AA, Hermetically sealed glass case. (MELF, SOD-80, LL34) LEAD FINISH: Tin / Lead THERMAL RESISTANCE: (ROJEC): 100 ˚C/W maximum at L = 0 inch THERMAL IMPEDANCE: (ZOJX): 35 ˚C/W maximum POLARITY: Diode to be operated with the banded (cathode) end positive. MOUNTING SURFACE SELECTION: The Axial Coefficient of Expansion (COE) Of this Device is Approximately +6PPM/°C. The COE of the Mounting Surface System Should Be Selected To Provide A Suitable Match With This Device.
NOTE 1
No Suffix type numbers are .